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| Categories | Multilayer PCB Board |
|---|---|
| Brand Name: | Kingtech |
| Model Number: | Multilayer |
| Place of Origin: | China |
| Back drill: | 0.15mm |
| Surface Treatment: | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Misalignment of layers: | 0.1mm |
| Min. Core Thickness: | 0.03mm |
| Multi-Laminations: | 4 Times |
| Min. Vias Hole Size: | 0.15mm |
| Aspect Ratio: | 20:1 |
| Layer: | 2-48L |
| Company Info. |
| HONGKONG KINGTECH PCB SOLUTION LIMITED |
| Verified Supplier |
| View Contact Details |
| Product List |
Multilayer is a high-end FR4 Multilayer PCB product, which features 8 layers of PCB boards with a maximum board thickness of 6.0mm, a minimum line width/space of 0.05/0.05mm, and a maximum board size of 1000*600mm. It can provide 4 times of multi-laminations and a minimum core thickness of 0.03mm.
This FR4 Multilayer PCB product is ideal for those who need 8 Layer PCB Board with high-precision and detailed design. It is suitable for a variety of applications such as industrial control systems, automotive electronic systems, medical equipment, wireless communication systems, etc. The product provides a reliable way to connect components and achieve desired performance.
Multilayer is a great choice for 8 Layer PCB needs. With its advanced manufacturing technology and strict quality control, it ensures every product is of superior quality. It is designed to be durable and long-lasting, making it ideal for long-term projects.
| Technical Parameter | Value |
|---|---|
| Layer | 2-48L |
| Impedance Control | ±5% |
| Min. Vias Hole Size | 0.15mm |
| Misalignment of layers | 0.1mm |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. |
| Max. Board thickness | 6.0mm |
| Multi-Laminations | 4 Times |
| Min. PAD | 0.14mm For Inner Layer |
| Min. Core Thickness | 0.03mm |
| Back drill | 0.15mm |
Kingtech Multilayer is a high-performance FR4 multilayer PCB specifically designed for network server applications. With a maximum board thickness of 6.0mm, this 8 layer PCB board has a misalignment of layers of 0.1mm, and the impedance control is ±5%. It is available with various surface treatments, including HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, and Electroplated Silver. This product is manufactured in China and can be used for 2-48L multilayer PCBs.
Kingtech Multilayer PCB is the perfect solution for Network Server Multilayer PCBs. With a Model Number of Multilayer, this PCB is manufactured in China with a Min. PAD of 0.14mm for Inner Layer. It offers multiple Surface Treatment options like HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, and Electroplated Silver. Back drill is 0.15mm and Min. Core Thickness is 0.03mm. Min. Line Width/Space is 0.05/0.05mm.
Multilayer offers a range of technical support and services to its customers, including:
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Double Sided Multilayer PCB Board OEM Printing Circuit Board Assembly
0.15mm Back Drill Multilayer Circuit Board Fabrication Featuring ENIG Finish
Thickness 6.0mm Multilayer PCB Board Electroplated Silver Custom
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High Frequency Fast Turn Prototype Pcb Board Back Drill Potential 0.15mm
High Density Multilayer PCB Board Electroplated Silver Multilayer Flex Circuits
Electronic Multilayer PCB Board 6.0mm Multi Layer Circuit Board
ENIG Coated multilayer printed circuit board With 0.15mm Min. Vias Hole Size
OSP Multilayer PCB Board Network Server Hdi Multilayer Pcb OEM
Innovative Multilayer Prototype Pcb Assembly With Max. Board Thickness 6.0mm
