20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes

Introducing our newly shipped PCB which is based on the RT/duroid 6035HTC high Frequency material. The RT/duroid 6035HTC High Frequency substrate is a cutting-edge circuit material designed specifically for high power RF and microwave applications. With its ceramic filled PTFE composites, this exceptional PCB offers unparalleled performance and reliability. Let's delve into the features and benefits that make this PCB stand out from the rest.

Features:
1. DK of 3.5 +/- 0.05 at 10 GHz/23°C: The PCB provides a stable dielectric constant, ensuring consistent signal integrity and precise electrical characteristics.

2. Dissipation factor of 0.0013 at 10 GHz/23°C: With low loss tangent, this PCB exhibits excellent high-frequency performance, minimizing signal loss and distortion.

3. Thermal Coefficient of dielectric constant of -66 ppm/°C: The PCB's thermal stability ensures reliable operation across a wide range of temperatures, safeguarding against performance fluctuations.

4. Moisture Absorption 0.06%: The low moisture absorption rate enhances the PCB's durability and prevents degradation caused by moisture exposure.

5. Thermal Conductivity of 1.44 W/m/K at 80°C: With high thermal conductivity, this PCB efficiently dissipates heat, enabling lower operating temperatures for high-power applications.

6. CTE in X-axis of 19 ppm/°C, Y-axis of 19 ppm/°C, and Z-axis of 39 ppm/°C: The PCB's low coefficient of thermal expansion minimizes the risk of warping or damage due to temperature changes.

Benefits:
1. High Thermal Conductivity: The improved dielectric heat dissipation capability of the RT/duroid 6035HTC PCB allows for lower operating temperatures, ensuring optimal performance and reliability, particularly in high-power applications.

2. Low Loss Tangent: With excellent high-frequency performance, this PCB minimizes signal loss and distortion, enabling precise and reliable transmission of RF and microwave signals.

3. Thermally Stable Low Profile and Reverse Treat Copper Foil: The PCB's copper foil, featuring low profile and reverse treat properties, offers lower insertion loss and excellent thermal stability for the traces, resulting in enhanced signal integrity and durability.

4. Advanced Filler System: The innovative filler system employed in this PCB improves drillability and extends tool life, surpassing the performance of circuit materials that contain alumina fillers.

PCB Stackup:
This 2-layer rigid PCB features a copper layer of 35 μm on both sides, sandwiching the RT/duroid 6035HTC material with a thickness of 0.508 mm (20mil). The stackup design ensures optimal signal transmission and structural integrity.

PCB Construction Details:
The size of this PCB measuring 200.5mm x 41.5mm, with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3mm. The finished board thickness is 0.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. With a via plating thickness of 20 μm and a bare copper surface finish, this PCB is ready to meet your high-frequency application needs. It does not have top or bottom silkscreen, and no solder mask is applied. Every PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring optimal functionality and reliability.

PCB Statistics:
This PCB features 26 components and a total of 100 pads, with 58 thru-hole pads and 42 top surface mount technology (SMT) pads. There are no bottom SMT pads. The PCB includes 47 vias and is designed to accommodate 5 nets, providing versatility for various circuit configurations.

Accepted Standard and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly. It is available worldwide, making it accessible for customers across the globe.

Typical Applications:

The RT/duroid 6035HTC PCB is ideally suited for a range of applications, including:
- High-power RF and microwave amplifiers
- Power amplifiers
- Couplers
- Filters
- Combiners
- Power dividers

Experience the superior performance and reliability of the RT/duroid 6035HTC High Frequency PCB. Its exceptional thermal conductivity, low loss tangent, and advanced construction make it the perfect choice for demanding high-power RF and microwave applications.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners