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4.0W/mK Heat Sink Silicone Thermal Conductive Putty

Categories Thermal Conductive Gel
Brand Name: ZIITEK
Model Number: TIF040AB-12S
Certification: UL
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Name: 4.0W/mK Heat Sink Silicone Thermal Conductive Putty
Color: White / blue
keyword: thermal conductive Putty
Applications: Tablet Computer
Material: Silicone
Thermal conductivity: 4.0W/mK
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  • Product Details
  • Company Profile

4.0W/mK Heat Sink Silicone Thermal Conductive Putty

4.0W/mK Heat Sink Silicone Thermal Conductive Putty


Company Profile


With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


TIF040AB-12S-Datasheet-REV02.pdf



Ziitek TIF040AB-12S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.


< Good thermal conductive: 4.0W/mK

< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing


Applications


< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor


Typical Properties of TIF040AB-12S Series
Typical Uncured Material
PropertyNumericalTest Method
Color/Part AWhiteVisual
Color/Part BBlueVisual
Viscosity as Mixed (cps)1200,000 cpsGB/T 10247
Density3.1g/ccASTM D792
Mix Ratio1:1******
Shelf Life@25℃6 months******
Cure Schedule
Pot Life @25℃30min******
Cure @25℃60min******
Cure @100℃30min******
Cure Properties
ColorBlueVisual
Hardness45 shore 00ASTM D2240
Continuous Use Temp-45~200℃******
Voltage Strength200 V/milASTM D149
Dielectric Constant3.9 MHzASTM D150
Volume Resistivity1012 Ohm-meterASTM D257
Flame Rating94V0E331100
Thermal Conductivity4.0 W/MkISO22007-2
Specific heat capacity1.8 MJ/m³KISO22007-2

Product packing details:


50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.



Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


FAQ


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.


Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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