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2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Categories Ultra Soft Thermal Pad
Brand Name: AOK
Model Number: UTP100
Certification: RoHS, Reach, UL
Place of Origin: China
MOQ: 1000 pcs
Payment Terms: T/T
Delivery Time: 13-15 working days
Packaging Details: 400 mm x 200 mm
Product name: Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1.0w thermal conductivity
Usage Temperature(℃): -40 ℃ ~ 150 ℃
Color: White and Brick Red
Thickness: 0.5~12.0 mm
Tensile Strength(KN/m): 2.5
Hardness: 30±5 (Shore OO)
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2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity

AttributeValueTest Method
CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
ColorWhite and Brick RedVisual
Thickness(mm)0.5~12.0ASTM D374
Density(g/cc)2.5ASTM D792
Hardness(shore oo)30±5ASTM D2240
Tensile Strength(KN/m)2.5ASTM D624
Elongation(%)60ASTM D412
Usage Temperature(℃)-40~150--
Electrical
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)5.7ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal
Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

Product feature:
■ Thermal Conductivity:1.0 W/mK
■ Ultra soft and highly compliant
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ High cut through resistance
■ High breakdown voltage
thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
■ Elongation 60%


Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs


Quality 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications for sale
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