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| Categories | Embedded Processors |
|---|---|
| Brand Name: | Microchip |
| Model Number: | AT91SAM9X25-CU |
| Place of Origin: | USA |
| MOQ: | 50PCS |
| Price: | RFQ |
| Payment Terms: | T/T, Western Union, escrow, Paypal, Visa, MoneyGram |
| Supply Ability: | RFQ |
| Delivery Time: | Immediately |
| Packaging Details: | ESD/Vacuum/Foam/Cartons |
| RoHS: | PB Free |
| Mounting Style: | SMD/SMT |
| Package: | BGA-217 |
| Series: | SAM9X |
| Factory Pack Quantity: | 126 |
| Product Type: | Microprocessors |
Embedded Processors AT91SAM9X25-CU BGA-217 Microprocessors
Product Description:
The SAM9X25 is a member of the Microchip series of 400 MHz ARM926EJ-S™ embedded microprocessor units. This MPU features multiple networking/connectivity peripherals, optimized for industrial applications such as building automation, gateways and medical. The SAM9X25 features two 2.0A/B compatible Controller Area Network (CAN) interfaces and two IEEE Std 802.3-compatible 10/100 Mbps Ethernet MACs. Additional communication interfaces include a soft modem supporting exclusively the Conexant SmartDAA line driver, HS USB Device and Host, FS USB Host, two HS SDCard/SDIO/MMC interfaces, USARTs, SPIs, I2S, TWIs and 10-bit ADC. To ensure uninterrupted data transfer with minimum processor overhead, the SAM9X25 offers a 10-layer bus matrix coupled with 2 x 8 central DMA channels and dedicated DMAs for the high-speed connectivity peripherals. The External Bus Interface incorporates controllers for 4-bank and 8-bank DDR2/LPDDR, SDRAM/LPSDRAM, static memories, as well as specific circuitry for MLC/SLC NAND Flash with integrated ECC up to 24 bits. The SAM9X25 is available in a 217-ball BGA package with 0.8 mm ball pitch.
Application:
• Core • Memories • System running at up to 133 MHz • Low Power Mode
Parameter Table:
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FAQ:
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Quality Warranty Period:12 Months.
All products were tested before shipment, and the quality problems were negligible.
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