STM32WB55CGU6 QFPN48 MCU Chips Low Power High Performance IC

Description:

The STM32WB55xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.0 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.

The STM32WB55xx devices are designed to be extremely low-power and are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision that supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.

The STM32WB55xx devices embed high-speed memories (up to 1 Mbyte of Flash memory, up to 256 Kbyte of SRAM), a Quad-SPI Flash memory interface (available on all packages) and an extensive range of enhanced I/Os and peripherals.
Direct data transfer between memory and peripherals and from memory to memory is supported by fourteen DMA channels with a full flexible channel mapping by the DMAMUX peripheral.

Feature

• Includes ST state-of-the-art patented technology
• Radio
  • 2.4 GHz
  • RF transceiver supporting Bluetooth® 5 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and ZigBee® 3.0
  • RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
  • Programmable output power up to +6 dBm with 1 dB steps
  • Integrated balun to reduce BOM
  • Support for 2 Mbps
  • Dedicated Arm® 32-bit Cortex® M0 + CPU for real-time Radio layer
  • Accurate RSSI to enable power control
  • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
  • Support for external PA
  • Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB55-01E3 or MLPF-WB55-02E3)
• Ultra-low-power platform
  • 1.71 to 3.6 V power supply
  • – 40 °C to 85 / 105 °C temperature ranges
  • 13 nA shutdown mode
  • 600 nA Standby mode + RTC + 32 KB RAM
  • 2.1 µA Stop mode + RTC + 256 KB RAM
  • Active-mode MCU: < 53 µA / MHz when RF and SMPS on
  • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
• Performance benchmark
  • 1.25 DMIPS/MHz (Drystone 2.1)
  • 219.48 CoreMark® (3.43 CoreMark/MHz at 64 MHz)
• Energy benckmark
  • 303 ULPMark™ CP score
• Supply and reset management
  • High efficiency embedded SMPSstep-down converter with intelligent bypass mode
  • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
  • Ultra-low-power POR/PDR
  • Programmable voltage detector (PVD)
  • VBAT mode with RTC and backup registers
• Clock sources
  • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
  • 32 kHz crystal oscillator for RTC (LSE)
  • Internal low-power 32 kHz (±5%) RC (LSI1)
  • Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
  • Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25% accuracy)
  • High speed internal 16 MHz factory trimmed RC (±1%)
  • 2x PLL for system clock, USB, SAI and ADC

CHONGMING GROUP (HK) INT'L CO., LTD. located in Hong Kong and Shenzhen. We are an independent Distributor of Electronic Components,established in 2008. AS a growing fast company, CM GROUP is renowned for its world-class efficiency, excellent services, and extraordinary ability to supply electronic components that are hard to find and even obsolete. We have taken pride in our innovation, reliability and service, especially in the semiconductor marketplace.
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