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| Categories | Rigid Flex PCB | 
|---|---|
| Brand Name: | WITGAIN PCB | 
| Model Number: | Rigid-Flex PCB0002 | 
| Certification: | UL | 
| Place of Origin: | China | 
| MOQ: | 1 pcs/lot | 
| Price: | negotiable | 
| Payment Terms: | T/T | 
| Supply Ability: | 100k pcs/month | 
| Delivery Time: | 20 days | 
| Packaging Details: | Vacuum bubble bag packaging | 
| Place of Origin:: | Guangdong China | 
| Material:: | FR4+PI | 
| No of layers:: | 10 Layers | 
| Solder mask colour:: | Blue | 
| Surface technics:: | ENIG 2U' | 
| Min Lind Space&Width:: | 3/3mil | 
| Board Size: | 180mm*120mm | 
| Min BGA Size: | 9mil | 
| Company Info. | 
| Witgain Technology Limited | 
| View Contact Details | 
| Product List | 
Rigid Flex Printed Circuit Board 10 Layer Pcb FR4 And PI Material Laminated
1 10 Layer rigid flex printed circuit board.
2 FR4 material and PI material laminated.
3 Finished pcb thickness is 1.0mm.
4 Blue solder mask and white legend.
5 Board size is 240mm*125mm/2pcs.
6 Min hole size is 0.25mm.
7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated
8 Layer 4 to Layer 7 are flexible layers. Balance layers are rigid layers.
9 Surface treatment is immersion gold.
| NO | Item | Capability | 
| 1 | Layer Count | 1-24 Layers | 
| 2 | Board Thickness | 0.1mm-6.0mm | 
| 3 | Finished Board Max Size | 700mm*800mm | 
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) | 
| 5 | Warp | <0.7% | 
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc | 
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET | 
| 8 | Drill Hole Diameter | 0.1mm-6.5mm | 
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ | 
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ | 
| 11 | Aspect Ratio | 10:1 | 
| 12 | PTH Hole Tolerance | +/-3mil | 
| 13 | NPTH Hole Tolerance | +/-1mil | 
| 14 | Copper Thickness of PTH Wall | >10mil(25um) | 
| 15 | Line Width And Space | 2/2mil | 
| 16 | Min Solder Mask Bridge | 2.5mil | 
| 17 | Solder Mask Alignment Tolerance | +/-2mil | 
| 18 | Dimension Tolerance | +/-4mil | 
| 19 | Max Gold Thickness | 200u'(0.2mil) | 
| 20 | Thermal Shock | 288℃, 10s, 3 times | 
| 21 | Impedance Control | +/-10% | 
| 22 | Test Capability | PAD Size min 0.1mm | 
| 23 | Min BGA | 7mil | 
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc | 
Q1: What is HASL - Hot Air Solder Leveling?
A1:

HASL (Hot Air Solder Leveling) is a metallic surface finishing technique, which is performed on the outermost layer of the PCB board to protect the exposed copper surfaces like tracks until the component placement and soldering is completed.
The HASL coating is composed of Solder with 63% Tin and 37% Lead, and during the assembly process, this coating gets dissolved with the soldering material.

The HASL Coating is applied as per the steps below:

Advantages of HASL:
Limitations of HASL:
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