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| Categories | Programmable IC Chip | 
|---|---|
| Brand Name: | XILINX / AMD | 
| Model Number: | XC7A35T-2CPG236I | 
| Place of Origin: | original | 
| MOQ: | 1 | 
| Price: | Negotiable | 
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram | 
| Supply Ability: | 999999 | 
| Delivery Time: | 1-3 days | 
| Packaging Details: | standard | 
| Number of LogNumber of LABs/CLBs: | 2600 | 
| Total RAM Bitsage (Vdss): | 1843200 | 
| Number of I/ODrain (Id) @ 25°C: | 106 | 
| Voltage - Supplyds On, Min Rds On): | 0.95V ~ 1.05V | 
| Operating Temperature: | -40°C ~ 100°C (TJ) | 
| Mounting Type: | Surface Mount | 
XC7A35T-2CPG236I Programmable IC Chip Package 238-CSBGA low cost lowest power high performance
Number of LABs/CLBs  | 2600  | |
Number of Logic Elements/Cells  | 33280  | |
Total RAM Bits  | 1843200  | |
Number of I/O  | 106  | |
Voltage - Supply  | 0.95V ~ 1.05V  | |
Mounting Type  | ||
Operating Temperature  | -40°C ~ 100°C (TJ)  | |
Package / Case  | ||
Supplier Device Package  | 238-CSBGA (10x10)  | 
General Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the
complete range of system requirements, ranging from low cost, small
form factor,cost-sensitive, high-volume applications to ultra
high-end connectivity bandwidth, logic capacity, and signal
processing capability for the most demanding high-performance
applications. The 7 series FPGAs include:
• Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
• Artix®-7 Family: Optimized for low power applications requiring
serial transceivers and high DSP and logic throughput. Provides the
lowest total bill of materials cost for high-throughput,
cost-sensitive applications.
• Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
• Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology. Built on a state-of-the-art, high-performance,
low-power (HPL), 28 nm, high-k metal gate (HKMG) process
technology, 7 series FPGAs enable an unparalleled increase in
system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic
cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power
than previous generation devices to offer a fully programmable
alternative to ASSPs .

                                 
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