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8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.

Categories Surface Mount Fuses
Brand Name: AMPFORT
Model Number: 8810F
Certification: UR
Place of Origin: Dongguan,China
MOQ: 1000pcs
Price: 0.5~0.7 USD/PC
Payment Terms: T/T
Supply Ability: 200,000PCS PER DAY
Delivery Time: 7 workdays
Packaging Details: T/R,1K/REEL
Name: Chip Fuse
Dimension: 7.3x5.8x4.2mm
Operating temperature: -55~+125C
Rated Voltage: 24V~125V
Rated current: 20A~125A
Speed: Fast Acting
Mounting Type: Surface Mount
Fuse Type: Board Mount (Cartridge Style Excluded)
Case: 2-SMD, J-Lead
HTSUS: 8536.10.0040
ECCN: EAR99
RoHS Status: ROHS3 Compliant
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8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.


8810F Ultra-High Current Nano2 Fast Blow Subminiature SMD Chip Fuse 7.3x5.8x4.2mm 60A 70A 80A 100A 125A 125V Max.


Description Of The Subminiature SMD Chip Fuse


This high-current SMD fuse is a small, square, surface mount fuse that is designed as supplemental overcurrent protection for high-current circuits in various applications.


Ordering Info Of The Subminiature SMD Chip Fuse


PartAmpereVoltageBreaking
No.RatingRatingCapacity
RM.8810F.2020A

125V/120V/100V/85V/80V/

75V/72V/63V/58V/48V/32V

1500A@24V32V48V58V63V72V75V85VDC,

1000A@100VAC,300A@125V120V115V DC

RM.8810F.2525A
RM.8810F.3030A
RM.8810F.3232A
RM.8810F.3535A
RM.8810F.4040A
RM.8810F.4545A
RM.8810F.5050A
RM.8810F.6060A
RM.8810F.7070A
RM.8810F.8080A
RM.8810F.100100A
RM.8810F.125125A

Product Characteristics Of The Subminiature SMD Chip Fuse


NO.

Item

Content

Reference standards

1

Product Marking

Brand, Ampere RatingMarking standards
2

Operating Temperature

-55°C to 125°C–55ºC to 125ºC with proper derating
3

Solderability

T=240°C±5°C , t=3sec±0.5sec, Coverage≥95%MIL-STD-202, Method 208
4

Resistance to Soldering Heat

10 sec at 260°CMIL-STD-202, Method 210, Test condition B
5

Insulation Resistance (after Opening)

10,000 ohms minimumMIL-STD-202, Method 302, Test Condition A
6

Thermal Shock

5 cycles, -65°C / +125°C, 15 minutes at each extremeMIL-STD-202, Method 107, Test Condition B
7

Mechanical Shock

100G’s peak for 6 milliseconds, 3cyclesMIL-STD-202, Method 213, Test I
8

Vibration

0.03”amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrsMIL-STD-202, Method 201
9

Moisture Resistance

10 cyclesMIL-STD-202, Method 106
10

Salt Spray

5% salt solution, 48hrsMIL-STD-202, Method 101, Test Condition B

Typical Application Of The Subminiature SMD Chip Fuse


• Storage system power

• Cooling fan system for PC server

• Voltage regulator module

• Base station power supply

• Voltage regulator module for PC server

• High end servers / Blade computing

• Blade Servers
• Routers

• Drones

• Battery and BMS

• Telecom DC/AC Power
• Uninterrupted Power supply (UPS)
• High-power Battery Systems
• Power Factor Correction (PFC) in high wattage power supplies
• Power Distribution Units (PDUs)
• Industrial tools


• Battery Management System


Features Of The Subminiature SMD Chip Fuse


• Small size with high interrupting
• Low DCR, lower power dissipation
• Faster blow when fault condition happens
• Higher reliability standards refer to automotive items

• Fast acting

• Surface mount high current fuse

• Higher voltage rating up to 125VDC

• 7.3mm×5.8mm×4.2mm rectangle shape surface mount

• -55°C to 125°C Operating temperature

• Excellent environmental integrity

• Enhanced thermal cycling endurance

• RoHS compliant

• Halogen Free

• Pb Free


Benefits Of The Subminiature SMD Chip Fuse


• Single fuse solution for high current application requirements. Parallel fusing or use of over specked industrial type fuses can be avoided
• High wattage equipment can be designed with less board space reserved for protection components
• Relatively high interrupting rating will suit a wide variety of applications
• Guaranteed protection against overload and short circuit events in applications
• Enhance power efficiency by optimized thermal performance and minimizing power loss
• Applicable to a wide range and harsh operating environment
• Enhanced reliability and less susceptible to temperature cycling and vibration effects
• Environmental friendly and harmless to human
• Compatible with high volume assembly (Pick-and-place) requirements with the SMD configuration


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