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| Categories | Electronic Heat Sink |
|---|---|
| Place of Origin: | China |
| Packaging Details: | EPE,carton,plywood case or pallet |
| Price: | $45.00/pieces 1-99 pieces |
| Grade: | Al 6063+Al1060 |
| Application: | Heat Sink |
| Shape: | Custom |
| Alloy Or Not: | Is Alloy |
| Tolerance: | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
| Processing Service: | Bending, Welding, Punching, Cutting |
| Delivery Time: | 22-30 days |
| Fins Thickness: | 1.5mm |
| Baseplate Thickness: | 11 mm |
| Pitch: | 4 mm |
| Surface Treatment: | anodising |
| Company Info. |
| HEYU Technology Co., Ltd |
| View Contact Details |
| Product List |
Communication heatsink Custom bonded fin heatsink 108(W)*96(H)*290(L)mm
Product Name | Custom bonded fin heatsink 108(W)*96(H)*290(L)mm |
Material | AL 6063 T5;AL 1100 |
Detailed Size | As per customers' design,max width 1000mm,max height 200mm,min gap
1mm |
Advantage | Flexible pitch, height and width,manufactured without molds;smaller
volume and lightweight,an ideal selection for cooling high power
devices |
Sample Service | Samples with differernt sizes can be availabe for prototypes test
within 1 week |
Production Process | Aluminum plate cutting---Making the solts in the base---Fins
cutting--Bonding fins to base---CNC Machining---Deburring---
Cleaning--- Inspecting--Packing |
Surface Treatment | Degreasing,(Black) Anodizing,Sand Blasting,Painting,Chromating and
Laser marking |
Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
Experience | More than 20 years professional manufacturing experience |
Application | LED Lighting,Inverter,Welding Machine,Communication Device,Power
Supply Equipment,Electronic Industry,Thermoelectric
Coolers/Generator,IGBT/UPS Cooling Systems,etc. |
Introduction:
Material: Electronic heat sinks are typically made from thermally conductive materials such as aluminum or copper, which have high thermal conductivity to allow heat to be transferred away from the component. Other materials such as graphite or diamond can also be used for higher performance applications.
Mounting: Electronic heat sinks are typically mounted directly onto the electronic component using thermal interface material, such as thermal paste or tape, to improve thermal contact and heat transfer. Screws or other fasteners may also be used to secure the heat sink in place.
Advantages:
Water cooling heatsinks are commonly used in high-performance computing, gaming, and overclocking applications. They are especially well-suited for applications where high heat loads are present and where precise temperature control is required.
Application:
Computers: Electronic heat sinks are used to cool CPUs, graphics cards, and other components in desktop computers, laptops, and servers.
LED lighting: Electronic heat sinks are used in LED lighting systems to dissipate the heat generated by high-power LED chips. This helps to improve the lifespan and performance of the lighting system.
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