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| Categories | Embedded PC Board | 
|---|---|
| Brand Name: | PLINK | 
| Model Number: | Y-C1-TX2i | 
| Place of Origin: | China | 
| MOQ: | 1PCS | 
| Price: | USD189-USD199\PCS | 
| Payment Terms: | L/C, D/A, D/P, T/T | 
| Supply Ability: | In stock | 
| Delivery Time: | 15-30 work days | 
| NAME: | Intelligent Jetson TX2 Embedded PC Board Module Development Board for Unmanned Vessel | 
| Key word: | Intelligent Jetson TX2 Embedded PC Board Module Development Board for Unmanned Vessel | 
| USB3.0 ports (5Gbps bandwidth per port, 1A output current): | 2x USB 3.0 1x Micro USB | 
| Ethernet: | 1x RJ45 | 
| button: | 1x Recovery | 
| Expand interface: | 2x miniPCIE | 
| Function signal: | 2x CAN 4x GPIO 1x I2C | 
| HDMI 2.0 port (Max 6Gbps, 24bpp, 4096x2160@60Hz): | x1 | 
| SD card interface: | x1 | 
| Weight: | 51g | 
| Board Size: | 87mm×60mm×16mm | 
| Power Supply: | +7V~+19V | 
| Temperature: | -40~+85℃ | 
| 3.3V I2C interface: | 3.3V I2C interface | 
Intelligent Jetson TX2 Embedded PC Board Module Development Board for Unmanned Vessel
NVIDIA Jetson TX2 Carrier Board Development Board
The function(s) for each pin on the Jetson TX2 series module is fixed to a single Special-Function I/O (SFIO) or softwarecontrolled General Purpose I/O (GPIO). The Jetson TX2 series module has multiple dedicated GPIOs; each GPIO is individually configurable as Output/Input/Interrupt sources with level/edge controls. SFIO and GPIO functionality is configured using Multi-purpose I/O (MPIO) pads within the Jetson TX2 series module. To achieve system operation without the need of a lot of additional on-board components, the Jetson TX2 series module utilizes six types of MPIO pads:
ST (standard) pads are the most common pads on the chip; they are used for typical General Purpose I/O.
DD (dual-driver) pads are similar to the ST pads. A DD pad can tolerate its I/O pin being pulled up to 3.3V (regardless of supply voltage) as long as the pad’s output-driver is set to open-drain mode. There are special power-sequencing considerations when using this functionality.
CZ (controlled output impedance) pads are optimized for use in applications requiring tightly controlled output impedance. They are similar to ST pads except for changes in the drive strength circuitry and in the weak pull-ups/- downs.
LV_CZ (low voltage controlled impedance) pads are similar to CZ pads but are optimized for use with a 1.2V supply voltage (and signaling level). They support a 1.8V supply voltage (and signaling level) as a secondary mode.
DP_AUX pad is used as an auxiliary control channel for the Display Port which requires differential signaling
NVIDIA Jetson SBC TX2 Delevopment Board Y-C1-TX2i
Module: NVIDIA Jetson TX2 Industrial
1.26 TFLOPS + Pascal GPU + 8GB LPDDR4 + 32GB eMMC
The Y-C1 is a industrial development board with NVIDIA Jetson TX2 industrial module, and it is usually for intelligent embedded PC, UVA, It has two USB3.0 ports (5Gbps bandwidth per port, 1A output current), two CAN (onboard CAN transceiver), three 3.3V level common serial ports (UART), 1 3.3V level Debug serial port (UART), Four 3.3V bit programmable GPIOs etc.
| Interface | Quality | 
| USB3.0 | 2 | 
| SD card | 1 | 
| UART(3.3V) | 3 | 
| HDMI 2.0 | 1 | 
| Debug(3.3V) | 1 | 
| GPIO(3.3V) | 4 | 
| RTC battery pin header | 1 | 
| Type 621 RTC battery holder | 1 | 
| Gigabit Ethernet (10/100/1000 BASE-T) | 1 | 
| CAN | 2 | 
| I2C(3.3V) | 1 | 
| Fan Control | 1 | 
| Temperature | -40~+85°C | 
| Power | +7V~+19V | 
| Size | 87mm×60mm×16mm | 
| Weight | 51g | 
NVIDIA Jetson TX2 industrial Module Technical Specification
| AI Performance | 1.26 TFLOPS | 
| Memory | 8 GB 128-bit LPDDR4 | 
| Storage | 32 GB eMMC 5.1 | 
| CPU | Dual-core Denver 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor | 
| GPU | 256-core NVIDIA Pascal™ GPU | 
| Power | 10W | 20W | 
| CSI Camera | Up to 6 cameras | 
| Video Encode | 1x 4K60 (H.265) | 
| Video Decode | 2x 4K60 (H.265) | 
| Display | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 | 
| Networking | 10/100/1000 BASE-T Ethernet | 

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