Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning

China Manufacturer High quality Black PC Waffle Pack Chip Tray

The chip tray is mainly used for QFA, BGA, TSOP, PGA and other semiconductor packaging inspection, storage and transportation. They can also provide functions such as high temperature resistance, anti-static electricity and so on. We design and manufacture such products to meet the needs of our customers.

Hiner-pack as a specialist manufacturer of industrial products and component trays, we create trays for the transport, packaging, storage and protection of a wide variety of precision components. From optical components to electronic components, we will continue to do our best to create a richer lineup of IC trays and other products.

Details of the HN21120 Black Waffle Pack

HN21120 waffle pack is used to provide clean, safe packaging for bare mode and other microelectronic devices. It’s a standard design of a 4-inch square with a 10*8 matrix. The chip tray should be selected for pocket size, with the aim of not allowing the device to rotate or flip over in the pocket.

Hiner-pack has a large inventory of industry standard chip trays to meet your packaging needs. At the same time, according to the different needs of customers, there are also lids, clips and Tyvek paper for use with the chip tray base. In addition, we can also provide professional customized service according to the size and drawings provided by customers. With the perfect design to achieve the most reasonable loading.

Application of HN21120 Waffle Pack Chip Tray

Electronic component Semiconductor

Micro and Nano systems Sensor IC

Advantages

1.We made all products with best material had passed certificate.
2.We have our professional designer so that we can not only produce customers own design, but also we can design for customers based on the customers requests.
3.100% manufacturer,competitive price.
4.The samples are free.
5.We will provide best service since we meet the client,and will do our best to solve the entire problem.

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans:Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Ans:Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/