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| Categories | Piezoelectric Wafer | 
|---|---|
| Brand Name: | BonTek | 
| Model Number: | Piezoelectric Wafer | 
| Certification: | ISO:9001, ISO:14001 | 
| Place of Origin: | China | 
| MOQ: | 5 pcs | 
| Price: | Negotiable | 
| Payment Terms: | T/T | 
| Supply Ability: | 50000 pcs/Month | 
| Delivery Time: | 1-4 weeks | 
| Packaging Details: | Cassette/ Jar package, vaccum sealed | 
| Name: | Piezoelectric Wafer | 
| Diam.: | 3 inch, 4 inch, 6 inch | 
| Material: | Alpha Quartz | 
| Thickness: | 100um up | 
| Flat: | 22mm, 32.5mm, 47.5mm, 57.5mm, Notch | 
| Surface Finish: | Double Side Polish, Single Side Polish | 
| Use: | Surface Acoustic Wave application | 
| Ra: | <1nm, <0.5nm | 
| Company Info. | 
| Hangzhou Freqcontrol Electronic Technology Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
Single Crystal Quartz Wafer For SAW Filter Piezo Oscillator Resonator Accelerator
The cutting of quartz wafer to a certain orientation of the crystal coordinate axis is called the cutting pattern of quartz wafer. Due to the anisotropy of quartz crystal, the electrical and thermal properties of quartz slices are different due to their different elastic properties, piezoelectric properties and temperature properties.
There are two ways to express the cut symbol of quartz crystal, one
is the symbol representation prescribed by IRE standard, the other
is the custom symbol representation peculiar to quartz crystal. IRE
(cut type prescribed by the symbol (XYZlWt) with a set of letters
and Angle, said with XYZ three letters in order to represent the
chip thickness and length along the axis of the original location,
with t (thickness), l (length), W (width) to represent the rotating
direction, Angle counterclockwise said plus and minus sign said
clockwise.



| Material | Synthetic Piezoelectric Quartz Crystal | |||
| Cutting Angle | X / Y / Z / AT32°/33°/35°/36°/ BT / ST42.75° etc. or per Customized | |||
| Diameter/size | 3" (76.2mm) | 4" (100mm) | 6" (150mm) | 8" (200mm) | 
| Tol(±) | <0.20 mm | |||
| Thinnest Thickness | 0.08mm Min-up | 0.10mm Min-up | 0.20mm Min -up | 0.35mm Min- | 
| Primary Flat | 22mm | 32mm | 42.5mm | 57.5mm or notch | 
| LTV (5mmx5mm) | <1.5µm | |||
| TTV | <1.5~10 µm | |||
| Bow | ±10~±50um | |||
| Warp | <10~40µm | |||
| PLTV(<0.5um) | ≥95%(5mm*5mm) | |||
| Orientation Flat | All available | |||
| Surface Type | Single Side Polish / Double Side Polish / Lapped | |||
| Polished side Ra | <0.5nm or specific per requested | |||
| Back Side Criteria | General is 0.2-0.5µm or as customized | |||
| Edge Criteria | R=0.2mm or Bullnose | |||
| Material Property | ECD | Better than grade 4 | ||
| Inclusion | Better than grade II | |||
| Q-Value | Better than grade C | |||
| Wafer Surface Criteria | Particles ¢>0.3 µ m | <= 30 | ||
| Scratch, Chipping | None | |||
| Defect | No edge cracks, scratches, saw marks, stains | |||
| Packaging | Qty/Wafer box | 25pcs per box, Semi Standard | ||


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