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Categories | Printed Circuit Board Design |
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Place of Origin: | China |
MOQ: | Negotiable |
Price: | Negotiable |
Payment Terms: | T/T |
Supply Ability: | 100000pc/Month |
Delivery Time: | 4 Weeks |
Packaging Details: | PCB + Box |
Brand Name: | CUSTOM MADE |
Certification: | ISO/UL |
Keyword: | Printed Circuit Board Design |
Materials: | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
PCB Board: | POP boards, Normal Boards, FPC boards, Rigid-flex boards, Metal base boards |
SMT Lines: | 12 SMT lines |
Special Capability: | Gold Finger Plating, Peelable, Carbon ink |
Applications: | Industrial Control, Medical, Automotive Electronics, Communications, Internet |
Copper Thickness: | 0.3-12 oz |
Surface Finished: | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Payment Method: | T/T |
Whether to Support customization: | Support |
Logistics: | Accept customer specified logistics |
Company Info. |
TONGZHAN INDUSTRIAL LIMITED |
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Product List |
High-Reliability Printed Circuit Board Design High - Tg FR4 Carbon Ink
Printed Circuit Board Design Description:
1. PCB design type: High-Speed, Analog, Digital-analog Hybrid, High Density/Voltage/Power, RF, Backplane, ATE, Soft Board, Rigid-Flex Board, Aluminum Board, etc.
2. Design tools: Allegro, Pads, Mentor Expedition.
Printed Circuit Board Design Parameters:
SMT Capability | 14 million spots per day |
SMT Lines | 12 SMT lines |
Reject Rate | R&C: 0.3% |
IC: 0% | |
PCB Board | POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards |
Parts Dimension | Min BGA Footprint:03015 Chip/0.35mm BGA |
Parts SMT Accuracy:±0.04mm | |
IC SMT Accuracy:±0.03mm | |
PCB Dimension | Size:50*50mm-686*508mm |
Thickness: 0.3-6.5mm |
Printed Circuit Board Design Introduction:
The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD).
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