1. Designs conform to the JEDEC international standard and have
strong versatility.
2. Optimal product design can provide a variety of packaging ICs
with protection while reducing transportation costs.
3. A variety of materials for customers to choose from to meet your
ESD and process requirements.
4. Support for non-standard format customization.
5. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC, SiP etc. All packaging methods
are available. Can be customized based on customers' requirement
(e.g, ESD property, Baking Temp, Baking Time).
6. The design of the structure and shape in line with JEDEC
international standards can also perfectly meet the requirements of
the carrying components or IC of the tray, carrying function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, and improve work efficiency.
Application:
Package IC, PCBA module component, Electronic component packaging, Optical device packaging.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN1876 | Cavity Size | 2.9X4.1X2.7mm |
| Package Type | IC | Size | Customizable |
| Material | PC | Flatness | MAX 0.76mm |
| Resistance | 1.0x10e4-1.0x10e11Ω | Service | Accept OEM, ODM |
| Color | Yellow | Certificate | RoHS |
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be
customized |