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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
Categories Burn In Test PCB
Brand Name: TOPCBS
Model Number: BIB and test Boards
Certification: UL94V0
Place of Origin: Suzhou China
MOQ: Negotiation
Price: Negotiation
Payment Terms: T/T
Supply Ability: 10000unit per month
Delivery Time: 10-14working days
Packaging Details: 20units per package box size 20*15*10cm
Layer count: 12Layer
Raw material: High Tg FR4
Finished Treatment: Immerion Gold + OSP
Pitch Size: 0.25mm
Board thickness: 0.7mm
Line width/space: 75um/100um
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Company Info.
Topmatch Electronics (Suzhou) Co., Limited.
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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board


  • Reduced product development time
  • Increased customer confidence
  • 100% product quality and reliability
  • A forecast life expectancy
  • Reduced circuit board manufacturing costs
  • Increased profitability
  • Reduced after sales service

1 . Descriptions:


What is a BIB ?


A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


2 . Specifications:


Name0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers12
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialIT180
Thickness0.7mm
Min Track/Spacing75um/75um
Min Hole SizeLaser 75um
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold + OSP
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

Product Tags:

pcb burn in test 0.25 pitch

  

hdi pcb burn-in test procedure 0.25 pitch

  

hdi pcb burn-in test procedure 12Layer

  
Quality High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer for sale

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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