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| Categories | HDI PCB Board | 
|---|---|
| Brand Name: | WITGAIN PCB | 
| Model Number: | S04E3698A0 | 
| Certification: | UL Certificate | 
| Place of Origin: | China | 
| MOQ: | negotiable | 
| Price: | negotiable | 
| Payment Terms: | T/T | 
| Supply Ability: | 1kkpcs/month | 
| Delivery Time: | 25 work days | 
| Packaging Details: | 400pcs/bag, 20bags/carton | 
| Blind Hole: | L2-L3 0.2MM | 
| Buried Hole: | L1-L2 0.1MM , L3-L4 0.1MM | 
| Layer Count: | 4 Layer | 
| Material: | FR4 | 
| Surface Treatment: | OSP+Immersion Gold | 
| Solder Mask: | Green | 
| Company Info. | 
| Witgain Technology Ltd | 
| View Contact Details | 
| Product List | 
4 Layer Printed Circuit Board With Blind And Buried Holes , Half Hole PCB , OSP+ENIG
4 Layer Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 1.0MM
Material: FR4
Copper Thickness: 1/H/H/1OZ
Min Hole: 0.1MM
Min Line: 3/3 Mil
BGA Size: 8Mil
Unit Size: 82*109.6MM/20UP
Hole: L1-L4, L2-L3, L3-L4, L1-L2
Min Distance Between Inner Layer Line to Holes: 5Mil
Solder Mask: Green
Surface Treatment: ENIG+OSP(OSP for BGA Pads)
Special Treatment: Half Plated Holes
Application: GPS Module
Capabilities:
| Item | Capability | 
| Layer Count | 1-24 Layers | 
| Board Thickness | 0.1mm-6.0mm | 
| Finished Board Max Size | 700mm* 800mm | 
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) | 
| Warp | <0.7% | 
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc | 
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET | 
| Drill Hole Diameter | 0.1mm-6.5mm | 
| Out Layer Copper Thickness | 1/20Z-8OZ ; | 
| Inner Layer Copper Thickness | 1/3OZ-6OZ | 
| Aspect Ratio | 10:1 | 
| PTH Hole Tolerance | +/-3mil | 
| NPTH Hole Tolerance | +/-1mil | 
| Copper Thickness Of PTH Wall | >10mil(25um) | 
| Line Width And Space | 2/2mil | 
| Min Solder Mask Bridge | 2.5mil | 
| Solder Mask Alignment Tolerance | +/-2mil | 
| Dimension Tolerance | +/-4mil | 
| Max Gold Thickness | 200u'(0.2mil) | 
| Thermal Shock | 288C, 10s, 3 Times | 
| Impedance Contro | +/-10% | 
| LTest Capability | PAD Size Min 0.1mm | 
| Min BGA | 7mil | 
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable | 
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
Question: Why use surface treatment ENIG+OSP?
Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.
Question: Is the cost for ENIG+OSP higher than ENIG?
Answer: Yes it is. But it won't make a big difference.
                                 
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