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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Categories CPU Thermal Pad
Brand Name: Ziitek
Model Number: TIF112-12-10S-K1
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*23*12cm cantons
Products name: Ultra Soft CPU Thermal Pad For Telecommunication Hardware
Thickness: 0.012"(0.30mm)
Specific Gravity: 2.2g/cc
Dielectric Breakdown Voltage: >5500 VAC
Thermal conductivity: 1.2W/m-K
color: Gray
Operating Temp: -40~120℃
Keywords: CPU Thermal pad
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  • Product Details
  • Company Profile

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Ultra Soft CPU Thermal Pad For Telecommunication Hardware


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Product introduction


TIF112-12-10S-K1 Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture, tear, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.


Features
> Good thermal conductive: 1.2W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices


Typical Properties of TIF112-12-10S-K1 Series
PropertyValueTest method
ColorGray/ Light amberVisual
Construction &CompostionCeramic filled silicone elastomer***
Renforcement carrierPolyimide film***
Thickness range0.012"(0.30mm)ASTM D374
Hardness60±5 Shore CASTM 2240
Specific Gravity2.2 g/ccASTM D792
Continuos Use Temp-40 to 120℃***
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity1.0X10¹²"Ohm-meterASTM D257
Fire rating94 V0UL E331100
Thermal conductivity1.2W/m-KASTM D5470

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Quality Ultra Soft CPU Thermal Pad For Telecommunication Hardware for sale
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