| Sign In | Join Free | My futurenowinc.com | 
 | 
| Categories | High TG PCB | 
|---|---|
| Brand Name: | Bicheng | 
| Model Number: | BIC-460.V1.0 | 
| Certification: | UL, ISO9001, IATF16949 | 
| Place of Origin: | CHINA | 
| MOQ: | 1PCS | 
| Price: | USD9.99-99.99 | 
| Payment Terms: | T/T | 
| Supply Ability: | 5000PCS per month | 
| Delivery Time: | 8-9 working days | 
| Packaging Details: | Vacuum bags+Cartons | 
| Base material: | FR-4 | 
| Layer count: | 6 Layers | 
| PCB thickness: | 0.6 mm +/-0.01 | 
| PCB size: | 100 x 103mm=1PCS | 
| Solder mask: | Green | 
| Copper weight: | 0.5oz | 
| Surface finish: | Immersion gold | 
| Company Info. | 
| Bicheng Electronics Technology Co., Ltd | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking. It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm are resin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.
Features and benefits
1. Via in pad design reduced the inductive reactance and capacitive reactance of the transmission line;
2. Immersion gold finish has high solderability, no stressing of circuit boards and less contamination of PCB surface;
3. Products and manufacturing are certified by authorized organizations;
4. Eligible products rate of first production: >95%;
5. Prototype PCB capability to volume production capability;
6. Delivery on time: >98%;
7. More than 18+ years of PCB experience;
8. IPC Class 2 / IPC Class 3;
PCB Specifications
| PCB SIZE | 100 x 103mm=1PCS | 
| BOARD TYPE | Multilayer PCB | 
| Number of Layers | 6 layers | 
| Surface Mount Components | YES | 
| Through Hole Components | NO | 
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP CS | 
| 4mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 4mil FR-4 | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil FR-4 | |
| copper ------- 18um(0.5oz) SIG | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) BOT PS | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 3mil/3mil | 
| Minimum / Maximum Holes: | 0.22/3.50mm | 
| Number of Different Holes: | 25 | 
| Number of Drill Holes: | 2315 | 
| Number of Milled Slots: | 0 | 
| Number of Internal Cutouts: | 0 | 
| Impedance Control | no | 
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT140 TG>135, er<5.4 | 
| Final foil external: | 1oz | 
| Final foil internal: | 0.5oz | 
| Final height of PCB: | 0.6mm ±0.1 | 
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.025µm over 3µm Nickel (14.4% area) | 
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum | 
| Solder Mask Color: | Green, TAIYO PSR-2000 GT600D | 
| Solder Mask Type: | LPSM | 
| CONTOUR/CUTTING | Routing | 
| MARKING | |
| Side of Component Legend | No silkscreen requried. | 
| Colour of Component Legend | No silkscreen requried. | 
| Manufacturer Name or Logo: | No silkscreen requried. | 
| VIA | Plated through hole(PTH), Blind via and via capping on CS and PS, vias not be visible. | 
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. | 
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) | 
| Board plating: | 0.0030" (0.076mm) | 
| Drill tolerance: | 0.002" (0.05mm) | 
| TEST | 100% Electrical Test prior shipment | 
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc | 
| SERVICE AREA | Worldwide, Globally. | 
Applications
-Led Lighting
-Intercom System
-Portable WiFi Router
-GSM Tracker
-Commercial Led Lighting
-Modem WiFi 4G
-Honeywell Access Control
-Electronic Access Control
-Audio Frequency Amplifier
-File servers

Via in pad (VIP)
At present, the circuit board is becoming more and more dense and interconnected, and there is no more room for these wires and pads connecting the holes. Therefore, so in this context, the process of punching the holes on the pads arises at the historic moment. In brief, the via holes which have been plated through are plugged or filled by insulating resin through the method of screen leakage, and then drying, grinding, and then electroplating, so that the whole surface of the PCB is coated with copper, and no longer via holes can be seen.
The effect of via in pad is also very obvious: such as improved the electrical performance and reliability of electronic products, shorten the signal transmission wire, reduced the inductive reactance and capacitive reactance of the transmission line, and reduced internal and external electromagnetic interference.
Let’s see the basic process of via in pad.

|   | 
 RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster
                                                                                    
                        
                        
                        
                                                            RO4350B 4 Layer IPC 6012 Class 2 High TG PCB For 4G Signal Booster
                                                    
                        
                     PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
                                                                                    
                        
                        
                        
                                                            PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
                                                    
                        
                     Immersion Gold FR4 High TG PCB With HASL Leadfree Surface Finishing
                                                                                    
                        
                        
                        
                                                            Immersion Gold FR4 High TG PCB With HASL Leadfree Surface Finishing
                                                    
                        
                     Immersion Gold Printed Circuit High TG PCB With 90Ohm Impedance Control
                                                                                    
                        
                        
                        
                                                            Immersion Gold Printed Circuit High TG PCB With 90Ohm Impedance Control
                                                    
                        
                     Rogers 4360 High Frequency PCB 16mil Double Sided RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers
                                                                                    
                        
                        
                        
                                                            Rogers 4360 High Frequency PCB 16mil Double Sided RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers
                                                    
                        
                     Rogers RO4360 RF PCB 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas
                                                                                    
                        
                        
                        
                                                            Rogers RO4360 RF PCB 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas
                                                    
                        
                     3 Layer Hybrid PCB 13.3mil RO4350B And 31mil RT Duroid 5880 High TG PCB
                                                                                    
                        
                        
                        
                                                            3 Layer Hybrid PCB 13.3mil RO4350B And 31mil RT Duroid 5880 High TG PCB
                                                    
                        
                     PCB with Peelable Mask Double Sided Circuit Board Built on Tg170 FR-4 Coating HASL.
                                                                                    
                        
                        
                        
                                                            PCB with Peelable Mask Double Sided Circuit Board Built on Tg170 FR-4 Coating HASL.
                                                    
                        
                     Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board
                                                                                    
                        
                        
                        
                                                            Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board
                                                    
                        
                     Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold
                                                                                    
                        
                        
                        
                                                            Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold