High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

The TIF180-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipationfins or the metal base.Their flexibility and elasticity make them suited tocoat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Good thermal conductivity: 1.5 W/mK

> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Application

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068