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| Categories | Arlon PCB Board |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-107-V1.07 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 2.99-6.99 PER PIECE |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 10 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 2 |
| Glass Epoxy:: | PTFE F4B |
| Final foil: | 1 Oz |
| Final height of PCB:: | 3.0 mm ±10% |
| Surface Finish: | Immersion gold |
| Solder Mask Color:: | Black |
| Colour of Component Legend: | White |
| Test: | 100% Electrical Test prior shipment |
Metal Based High Frequency PCB Built on Modified Woven Fabric Glass Teflon (PTFE) Copper Clad Laminates with Ceramic Filler
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.
Parameters
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃) : -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td (℃): 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
Data Sheet of F4BTMS Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler
| Designator of Substrate | Material Composition / Dielectric Layer | Types | DK @ 10GHz & Tolerance | Thermal Change of Dk(ppm/℃) | Loss Tangent, Df@10GHz | Thermal Conductivity(W/mk) | Td (℃) | Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) | Density (g/cm3): | Volume Resisivity (Mohm.cm) | Surface Resistivity (Mohm) | Moisture Absorption (%) | Peel Strength (N/cm) (1oz) | Flammability Rating | ||
| X | Y | Z | ||||||||||||||
| F4BTMS | PTFE/Ceramic/Superfine woven glass | F4BTMS220 | 2.20±0.03 | -48 | 0.0010 | 0.35 | 476 | 40 | 45 | 98 | 1.80 | 1X108 | 1X108 | 0.02 | 20 | V-0 |
| F4BTMS294 | 2.94±0.04 | -20 | 0.0012 | 0.58 | 490 | 10 | 12 | 22 | 2.25 | 1X108 | 1X108 | 0.03 | 12 | V-0 | ||
| F4BTMS300 | 3.00±0.04 | -20 | 0.0013 | 0.58 | 490 | 10 | 11 | 22 | 2.28 | 1X108 | 1X108 | 0.04 | 12 | V-0 | ||
Type of Metal Base: Aluminum, Copper
Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm
Base copper: 0.5oz, 1oz
Thickness and size F4BTMS
| Designator of Substrate | Standard Dielectric Thickness(Without the cladding) and Tolerance | Available Copper Foil | Standard Size | |
| F4BTMS | 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) | Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. | 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper | 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48") |
| PCB Capability | |
| PCB Material: | Modified PTFE Copper Clad with Ceramic Filler |
| Designator: | F4BTMS220 |
| Dielectric constant @ 10GHz: | 2.2 |
| Layer count: | Single Layer |
| Copper weight: | 0.5oz, 1oz |
| PCB thickness: | 1.2mm - 9.0mm |
| 0.047” - 0.354” | |
| Solder mask: | Green, Red, Black, White, Blue etc. |
| PCB size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
|
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