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| Categories | PCB Prototype Service | 
|---|---|
| Brand Name: | China chao sheng | 
| Model Number: | cspcb1506 | 
| Certification: | ISO/UL/RoHS/TS | 
| Place of Origin: | Shenzhen, Guangdong, China | 
| MOQ: | 1PCS | 
| Price: | usd5.28/pcs | 
| Payment Terms: | T/T, Western Union | 
| Supply Ability: | 200000pcs / per per day | 
| Delivery Time: | 25-35day | 
| Packaging Details: | Anti-static bag + Anti-static bubble wrap + Good quality carton box | 
| Product Areas: | Communication Systems | 
| Material: | Halogen-free FR-4 TG180 | 
| Product Structure: | 20 Layers AnylayerHDI | 
| Line Width And Space: | 3/3mil | 
| Minimum Hole: | 0.10mm | 
| Plate thickness: | 2.60mm | 
| Mpedance Value: | ± 10% | 
| Surface Treatment: | Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin | 
| Provide PCB Information: | Gberber, Production Requirements, MOQ Quantity | 
| PCBA Information: | BOM Report, X, Y Left Plot | 
20 layers AnylayerHDI, Halogen-free FR-4 TG180 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boards, prototype pcb fabrication
1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG180, inner and outer copper thickness 35um, minimum line width line
spacing 3/3mil, hole ratio 10:1, minimum hole 0.10mm, blind hole
buried hole, immersion gold, red solder resist, white
3: The board thickness is 2.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test
Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic
communications, computers, household appliances, appliances, SD
cards, SG cards, mobile phones, antennas, computers, automobiles,
music equipment, playback equipment, banking equipment, medical
instruments, medical equipment, medical equipment, aerospace,
Aviation, military, LED, OLED, OLCD power control power supply,
industrial power supply, communication power supply, automotive
power supply, office equipment, digital products, computers and
other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone,
connector, module, walkie-talkie antenna card, high-end camera,
digital, camera, laser head, CD, medical, instrumentation, drive,
automotive instrumentation, medical instrument , Medical equipment,
banking equipment, industrial instruments, LED strips, military
industry, aviation, aerospace, national defense and other high-tech
products, more than 70% of the products are exported to the
Americas, Europe, Japan, Asia Pacific and other countries and
regions.
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology | |||||
| 2016 | 2017 | 2018 | |||||
| Max.Layer Count | 26L | 36L | 80L | ||||
| Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
| The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
| Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
| Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
| HDI PCB | 4~45L | 4~60L | 4~80L | ||||
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
| Build-up Material | FR-4 | FR-4 | FR-4 | ||||
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
| Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
| Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
| Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
| MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
| Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
| Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
| 125(5) | 125(5) | 125(5) | |||||
| SKipvia | Yes | Yes | Yes | ||||
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
| Laser Hole Filling | Yes | Yes | Yes | ||||
| Technicalltem | Mass Product | Advanced Technolgy | |||||
| 2017year | 2018year | 2019year | |||||
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
| Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
| ≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
| Multi-layer overlay | N+N | N+N | N+N | ||||
| N+X+N | N+X+N | N+X+N | |||||
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
| PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | ||||


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