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| Categories | PCB Prototype Service | 
|---|---|
| Brand Name: | China chao sheng | 
| Model Number: | CSPCB1511 | 
| Certification: | ISO/UL/RoHS/TS | 
| Place of Origin: | Shenzhen, Guangdong, China | 
| MOQ: | 1PCS | 
| Price: | USD2.10/pcs | 
| Payment Terms: | T/T, Western Union | 
| Supply Ability: | 500000pcs per month | 
| Delivery Time: | 15-18day | 
| Packaging Details: | Anti-static bag + Anti-static bubble wrap + Good quality carton box | 
| Application: | Industrial consumer products | 
| Base Material: | FR-4 TG130 | 
| Minimum Hole: | 4/4mil | 
| Product Structure: | 10 Layers | 
| Board Thickness: | 1.20mm | 
| Surface Finishing: | ENIG | 
| Provide PCB Information: | Gberber, Production Requirements, MOQ Quantity | 
| E-Test: | 100% Electrical Test Prior Shipment | 
10 layers  FR-4, TG140 r ,HDI Printed Circuit Boards,prototype pcb fabrication PCB Lamination Structure PCB Requires Curators
We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,12 layers,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.
Process parameters:
| Content | Capability | 
| Material | FR4, TG130, TG140, TG160, TG170 TG180 TG240 | 
| Surface treatment | HASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger | 
| Layers | Single-sided,double-sided,4 layers, 6,8,10,12 Layers | 
| Maxi. board size | 800mmX508mm | 
| Line width/space | 0.1mm/ 0.1mm | 
| Board thickness | 0.2mm-4mm | 
| Min.tolerance of Board thickness | +/-8% - 10% | 
| Copper foil thickness | Out Layer:17.5um/35um/70um/105um/140um/175um Inner Layer:17.5um/35um/70um/105um/140um | 
| Outline Tolerance | CNC routing:+/-0.1mm , Punching: +/-0.1mm | 
| V-CUT registration | +/-0.15mm | 
| PTH hole copper thickness | 15um-50um | 
| Warp and twist | <=1% | 
| Min registration of hole position | +/-3mil(+/-0.76mm) | 
| Min punching hole | 0.8mm(Board thickness below 1.0mm .) | 
| Min Punching Square slot | (Board thickness below 1.0mm, 1.0mmX1.0mm) | 
| Registration of printed circuit | +/-0.076mm | 
| Min drill hole diameter | 0.2mm | 
| Min tolerance of hole diameter | +/-0.05mm | 
| Thickness of surface treatment | Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um) Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um) Plating Silver:(Ag 5um-8um) | 
| V-CUT degree tolerance | +/-5(degree) | 
| V-CUT Board thickness | 0.6mm-3.2mm | 
| Min Legend width | 0.1mm | 
| Min Solder mask width | 0.1mm | 
| Min Solder mask ring | 0.05mm | 


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