Sign In | Join Free | My futurenowinc.com
futurenowinc.com
Products
Search by Category
Home > Other Food Processing Machinery >

4H N Type SiC , Dummy Grade , 6”Size For Wafer Or Equipment Running Test

Categories SiC Wafer
Brand Name: PAM-XIAMEN
Place of Origin: China
MOQ: 1-10,000pcs
Price: By Case
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
Delivery Time: 5-50 working days
name: silicon carbide wafer
Grade: Dummy Grade
Type: N Type
Size: 6 inch
keywords: SiC wafer
application: researcher
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

4H N Type SiC , Dummy Grade , 6”Size For Wafer Or Equipment Running Test

4H N Type SiC , Dummy Grade , 6”Size For Wafer Or Equipment Running Test


PAM-XIAMEN offers semiconductor silicon carbide wafers,6H SiC and 4H SiC in different quality grades for researcher and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and optoelectronic Devices. As a professional company invested by the leading manufacturers from the fields of advanced and high-tech material research and state institutes and China’s Semiconductor Lab,weare devoted to continuously improve the quality of currently substrates and develop large size substrates.


Here shows detail specification:

SILICON CARBIDE MATERIAL PROPERTIES

PolytypeSingle Crystal 4HSingle Crystal 6H
Lattice Parametersa=3.076 Åa=3.073 Å
c=10.053 Åc=15.117 Å
Stacking SequenceABCBABCACB
Band-gap3.26 eV3.03 eV
Density3.21 · 103 kg/m33.21 · 103 kg/m3
Therm. Expansion Coefficient4-5×10-6/K4-5×10-6/K
Refraction Indexno = 2.719no = 2.707
ne = 2.777ne = 2.755
Dielectric Constant9.69.66
Thermal Conductivity490 W/mK490 W/mK
Break-Down Electrical Field2-4 · 108 V/m2-4 · 108 V/m
Saturation Drift Velocity2.0 · 105 m/s2.0 · 105 m/s
Electron Mobility800 cm2/V·S400 cm2/V·S
hole Mobility115 cm2/V·S90 cm2/V·S
Mohs Hardness~9~9

4H N Type SiC, Dummy Grade,6”Size

SUBSTRATE PROPERTYS4H-51-N-PWAM-330 S4H-51-N-PWAM-430
DescriptionDummy Grade 4H SiC Substrate
Polytype4H
Diameter(50.8 ± 0.38) mm
Thickness(250 ± 25) μm (330 ± 25) μm (430 ± 25) μm
Carrier Typen-type
DopantNitrogen
Resistivity (RT)0.012 – 0.0028 Ω·cm
Surface Roughness< 0.5 nm (Si-face CMP Epi-ready); <1 nm (C- face Optical polish)
FWHM<50 arcsec
Micropipe DensityA+≤1cm-2 A≤10cm-2 B≤30cm-2 C≤50cm-2 D≤100cm-2
Surface Orientation
On axis<0001>± 0.5°
Off axis4°or 8° toward <11-20>± 0.5°
Primary flat orientationParallel {1-100} ± 5°
Primary flat length16.00 ± 1.70) mm
Secondary flat orientationSi-face:90° cw. from orientation flat ± 5°
C-face:90° ccw. from orientation flat ± 5°
Secondary flat length8.00 ± 1.70 mm
Surface FinishSingle or double face polished
PackagingSingle wafer box or multi wafer box
Usable area≥ 90 %
Edge exclusion1 mm

Single crystal SiC Properties

Here we compare property of Silicon Carbide, including Hexagonal SiC,CubicSiC,Single crystal SiC.

Property of Silicon Carbide (SiC)

Comparision of Property of Silicon Carbide, including Hexagonal SiC,Cubic SiC,Single crystal SiC:

PropertyValueConditions
Density3217 kg/m^3hexagonal
Density3210 kg/m^3cubic
Density3200 kg/m^3Single crystal
Hardness,Knoop(KH)2960 kg/mm/mm100g,Ceramic,black
Hardness,Knoop(KH)2745 kg/mm/mm100g,Ceramic,green
Hardness,Knoop(KH)2480 kg/mm/mmSingle crystal.
Young's Modulus700 GPaSingle crystal.
Young's Modulus410.47 GPaCeramic,density=3120 kg/m/m/m, at room temperature
Young's Modulus401.38 GPaCeramic,density=3128 kg/m/m/m, at room temperature
Thermal conductivity350 W/m/KSingle crystal.
Yield strength21 GPaSingle crystal.
Heat capacity1.46 J/mol/KCeramic,at temp=1550 C.
Heat capacity1.38 J/mol/KCeramic,at temp=1350 C.
Heat capacity1.34 J/mol/KCeramic,at temp=1200 C.
Heat capacity1.25 J/mol/KCeramic,at temp=1000 C.
Heat capacity1.13 J/mol/KCeramic,at temp=700 C.
Heat capacity1.09 J/mol/KCeramic,at temp=540 C.
Electrical resistivity1 .. 1e+10 Ω*mCeramic,at temp=20 C
Compressive strength0.5655 .. 1.3793 GPaCeramic,at temp=25 C
Modulus of Rupture0.2897 GPaCeramic,with 1 wt% B addictive
Modulus of Rupture0.1862 GPaCeramifc,at room temperature
Poisson's Ratio0.183 .. 0.192Ceramic,at room temperature,density=3128 kg/m/m/m
Modulus of Rupture0.1724 GPaCeramic,at temp=1300 C
Modulus of Rupture0.1034 GPaCeramic,at temp=1800 C
Modulus of Rupture0.07586 GPaCeramic,at temp=1400 C
Tensile strength0.03448 .. 0.1379 GPaCeramic,at temp=25 C

*Reference:CRC Materials Science and Engineering Handbook

Comparision of Property of single crystal SiC, 6H and 4H:

PropertySingle Crystal 4HSingle Crystal 6H
Lattice Parametersa=3.076 Åa=3.073 Å
c=10.053 Åc=15.117 Å
Stacking SequenceABCBABCACB
Band-gap3.26 eV3.03 eV
Density3.21 · 103 kg/m33.21 · 103 kg/m3
Therm. Expansion Coefficient4-5×10-6/K4-5×10-6/K
Refraction Indexno = 2.719no = 2.707
ne = 2.777ne = 2.755
Dielectric Constant9.69.66
Thermal Conductivity490 W/mK490 W/mK
Break-Down Electrical Field2-4 · 108 V/m2-4 · 108 V/m
Saturation Drift Velocity2.0 · 105 m/s2.0 · 105 m/s
Electron Mobility800 cm2/V·S400 cm2/V·S
hole Mobility115 cm2/V·S90 cm2/V·S
Mohs Hardness~9~9

*Reference:Xiamen Powerway Advanced Material Co.,Ltd.

Comparision of property of 3C-SiC,4H-SiC and 6H-SiC:

Si-C Polytype3C-SiC4H-SiC6H-SiC
Crystal structureZinc blende (cubic)Wurtzite ( Hexagonal)Wurtzite ( Hexagonal)
Group of symmetryT2d-F43mC46v-P63mcC46v-P63mc
Bulk modulus2.5 x 1012 dyn cm-22.2 x 1012 dyn cm-22.2 x 1012 dyn cm-2
Linear thermal expansion coefficient2.77 (42) x 10-6 K-1  
Debye temperature1200 K1300 K1200 K
Melting point3103 (40) K3103 ± 40 K3103 ± 40 K
Density3.166 g cm-33.21 g cm-33.211 g cm-3
Hardness9.2-9.39.2-9.39.2-9.3
Surface microhardness2900-3100 kg mm-22900-3100 kg mm-22900-3100 kg mm-2
Dielectric constant (static)ε0 ~= 9.72The value of 6H-SiC dielectric constant is usually usedε0,ort ~= 9.66
Infrared refractive index~=2.55~=2.55 (c axis)~=2.55 (c axis)
Refractive index n(λ)n(λ)~= 2.55378 + 3.417 x 104·λ-2n0(λ)~= 2.5610 + 3.4 x 104·λ-2n0(λ)~= 2.55531 + 3.34 x 104·λ-2
ne(λ)~= 2.6041 + 3.75 x 104·λ-2ne(λ)~= 2.5852 + 3.68 x 104·λ-2
Radiative recombination coefficient1.5 x 10-12 cm3/s1.5 x 10-12 cm3/s
Optical photon energy102.8 meV104.2 meV104.2 meV
Effective electron mass (longitudinal)ml0.68mo0.677(15)mo0.29mo
Effective electron mass (transverse)mt0.25mo0.247(11)mo0.42mo
Effective mass of density of states mcd0.72mo0.77mo2.34mo
Effective mass of the density of states in one valley of conduction band mc0.35mo0.37mo0.71mo
Effective mass of conductivity mcc0.32mo0.36mo0.57mo
Effective hall mass of density of state mv?0.6 mo~1.0 mo~1.0 mo
Lattice constanta=4.3596 Aa = 3.0730 Aa = 3.0730 A
b = 10.053b = 10.053

* Reference: IOFFE

SiC 4H and SiC 6H manufacturer reference:PAM-XIAMEN is the world’s leading developer of solid-state lighting technology,he offer a full line: Sinlge crystal SiC wafer and epitaxial wafer and SiC wafer reclaim


SiC High-Power Rectifiers

The high-power diode rectifier is a critical building block of power conversion circuits. Recent reviews of experimental SiC rectifier results are given in References 3, 134, 172, 180, and 181. Most important SiC diode rectifier device design trade-offs roughly parallel well-known silicon rectifier trade-offs, except for the fact that current densities, voltages, power densities, and switching speeds are much higher in SiC. For example, semiconductor Schottky diode rectifiers are majority carrier devices that are well known to exhibit very fast switching owing to the absence of minority carrier charge storage that dominates (i.e., slows, adversely resulting in undesired waste power and heat) the switching operation of bipolar pn junction rectifiers. However, the high breakdown field and wide energy bandgap permit operation of SiC metal–semiconductor Schottky diodes at much higher voltages (above 1 kV) than is practical with siliconbased Schottky diodes that are limited to operation below ~200 V owing to much higher reverse-bias thermionic leakage.

Product Tags:

4h sic wafer

  

semi standard wafer

  
Quality 4H N Type SiC , Dummy Grade , 6”Size For Wafer Or Equipment Running Test for sale
Send your message to this supplier
 
*From:
*To: XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0