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| Categories | Multilayer PCB Board | 
|---|---|
| Brand Name: | OEM ODM | 
| Model Number: | SL81104S23 | 
| Certification: | UL, Rohs | 
| Place of Origin: | China | 
| MOQ: | No MOQ | 
| Price: | Negotiation | 
| Payment Terms: | T/T, Western Union, MoneyGram,Paypal | 
| Supply Ability: | 30000pcs per day | 
| Delivery Time: | 5-7 days | 
| Packaging Details: | ESD Bag | 
| Surface Finishing: | ENIG+OSP | 
| Class Standard: | IPC-6012 Class -II | 
| NPTH Tolerance: | +/-0.05mm | 
| Features 1: | Gerber/PCB File Needed | 
| Features 2: | 100% E-test | 
| Features 3: | Quality 2 Years Guarantee | 
High density interconncection Multilayer PCB Board Supplier in China
Multilayer PCB board
Production line process
Blank PCB
Material Cutting→Drilling→PTH→Photo process→Circuit
Exposure→Etching→Touch up→Pannel plating→Plug hole→Print Solder
mask ink→Surface Finish→Profile→Punch/V-cut→E-testing→→Final Visual
Inspection→Packing
PCB Capacity
PCB General Capability  | |
Number of Layer  | 1 - 18 Layer  | 
Maximum Processing Area  | 680 × 1000MM  | 
Min Board Thickness  | 2 Layer - 0.3MM ( 12 mil )  | 
4 Layer - 0.4MM ( 16 mil )  | |
6 Layer - 0.8MM ( 32 mil )  | |
8 Layer - 1.0MM ( 40 mil)  | |
10 Layer - 1.1MM ( 44 mil )  | |
12 Layer - 1.3MM ( 52 mil )  | |
14 Layer - 1.5MM ( 59 mil )  | |
16 Layer - 1.6MM ( 63 mil )  | |
18 Layer - 1.8MM ( 71 mil )  | |
Finished Board Thickness Tolerance  | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM  | 
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%  | |
Twisting and Bending  | ≤ 0.75%, Min: 0.5%  | 
Range of TG  | 130 - 215 ℃  | 
Impedance Tolerance  | ± 10%, Min: ± 5%  | 
Hi-Pot Test  | Max: 4000V/10MA/60S  | 
Surface Treatment  | HASL, With Lead, HASL Free Lead  | 
Flash Gold, Immersion Gold  | |
Immersion Silver, Immersion Tin  | |
Gold Finger, OSP  | |
PCB Cu Thickness + Plating  | |
Out Layer Cu Thickness  | 1 - 6OZ  | 
Inner Layer Cu Thickness  | 0.5 - 4OZ  | 
Cu Thickness of PTH  | 20UM ≤ Average ≤ 25UM  | 
Min: 18UM  | |
HASL with Lead  | Tin 63% Lead 37%  | 
HASL Free Lead  | 7UM ≤ Surface Thickness ≤ 12UM  | 
Thick Gold Plating  | Ni Thickness: 3 - 5UM ( 120u" - 200u" )  | 
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )  | |
Immersion Gold  | Ni Thckness: 3 - 5UM ( 120u" - 200u" )  | 
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )  | |
Immersion Silver  | Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )  | 
Gold Finger  | Ni Thickness: 3 - 5UM ( 120u" - 160u" )  | 
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )  | |
U940 PCB Pattern Limit Capability  | |
Min Width  | 0.075MM ( 3 mil )  | 
Min Trace  | 0.075MM ( 3 mil )  | 
Min Width of Ring ( Inner Layer )  | 0.15MM ( 6 mil )  | 
Min Width of Ring ( Out Layer )  | 0.1MM ( 4 mil )  | 
Min Solder Bridge  | 0.1MM ( 4 mil )  | 
Min Height of Legend  | 0.7MM ( 28 mil )  | 
Min Width of Legend  | 0.15MM ( 6 mil )  | 
PCB Holes Processing Capability  | |
Final Hole Size  | Min: Laser 0.1MM, Machine 0.2MM  | 
Drilling Hole Size  | 0.10 - 6.5MM  | 
Drilling Tolerance  | NPTH: ±0.05MM, PTH: ±0.075MM  | 
Final Hole Size Tolerance ( PTH )  | φ0.20 - 1.60MM ± 0.075MM  | 
φ1.60 - 6.30MM ± 0.10MM  | |
Final Hole Size Tolerance ( NPTH )  | φ0.20 - 1.60MM ± 0.05MM  | 
φ1.60 - 6.50MM ± 0.05MM  | |
Drilling Strip Hole  | -0L ~tu.'gth /width 2:1  | 
Min Strip Hole Width 0.65MM  | |
Length & Width Tolerance ± 0.05MM  | |
Board Thickness / Hole Size  | ≤ 10:1  | 
PCB Cover Thickness Capability  | |
Solder Mask Color  | Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White  | 
Solder Mask Thickness  | Surface Line ≥ 10UM  | 
Surface Line Corner ≥ 6UM  | |
Surface Board 10 - 25UM  | |
Solder Mask Bridge Width  | |
Legend Color  | White,Yellow,Black  | 
Min Height of Legend  | 0.70MM ( 28 mil )  | 
Min Width of Legend  | 0.15MM ( 6 mil )  | 
Blue Gel Thickness  | 0.2 - 1.5MM  | 
Blue Gel Tolerance  | ±0.15MM  | 
Carbon Print Thickness  | 5 - 25UM  | 
Carbon Print Min Space  | 0.25MM  | 
Carbon Print Impedance  | 200Ω  | 
Blind/Burried/Half Via PCB Capability  | |
Parameters  | (1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8  | 
Min Via  | Laser 0.1MM, Machine 0.2MM  | 
Half Via  | Min: 0.6MM  | 
Impedance Capability  | |
Resistance Value  | Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω  | 
PCB Photos


                                 
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