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| Categories | Phase Changing Materials |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIC800K |
| Certification: | RoHs |
| Place of Origin: | China |
| MOQ: | 1000PC |
| Price: | USD 0.03PCS |
| Supply Ability: | 100000PCS/DAY |
| Delivery Time: | 2-3Works |
| Packaging Details: | 1000PCS/bag |
| Product Name: | Phase Changing Materials |
| Color: | Light amber |
| Thermal Conductivity: | 1.8 W/mK |
| Phase Change Softening Temperature: | 50℃~60℃ |
| Work Temperature: | -40 °C to 180 °C |
| phase transition temperature: | 50℃~60℃ |
| Specific Gravity: | 2.0g/cc |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply
The TIC800K Series products is a high thermal conduction and
dielectric performance insulator pad
consisting of a ceramic filled low melting point compound coated on
MT Kapton film.At 50℃,TIS™700K Series surface begins to soften and
flow, filling the microscopic irregularities of both thethermal
solution and the integrated circuit package surface, thereby
reducing thermal resistan
TIC800K Series Datasheet-(E)-REV01.pdf
Feature
| Naturally tacky at room temperature, no adhesive required |
| No heat sink preheating required |
| Low thermal resistance |
| Ease of use for high volume manufacturing |
| High thixotropic index |
| Dry to the touch for pre-apply applications |
| High thermal reliability, minimal pump out |
| Re-flow compatible |
| Cost Effective |
| Used where electrical isolation is not required |
| Low volatility – less than 1% |
| Easy to handle in the manufacturing environment |
| Flows but doesn’t run like grease |
| Available in custom die-cut shapes, kiss-cut on rolls |
| RoHS Compliant |
Application
| High Frequency Microprocessors |
| Notebook |
| Computer Serves |
| Memory Modules |
| Cache Chips |
| IGBTs |
| COB Led |
| Desktop PCs |
| CPU |
| Microprocessors |
| Chipsets |
| Graphic Processing Chips |
| Custom ASICs |
| Servers |
| Memory Modules |
| Power semiconductors |
| Power conversion modules |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Typical Properties of TICTM800K Series | ||||
| Product Name | TICTM804K | TICTM805K | TICTM806K | Test Method |
| Color | light amber | light amber | light amber | Visual |
| Thickness | 0.004" (0.102mm) | 0.005" (0.127mm) | 0.006" (0.152mm) | |
| Thickness Tolerance | ±0.0008'' (±0.019mm) | ±0.0008'' (±0.019mm) | ±0.0012'' (±0.030mm) | |
| Density | 2 g/cc | Helium Pycnometer | ||
| Temperature range | -25℃～125℃ | |||
| Phase Change Softening Temperature | 50℃~60℃ | |||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) | ||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | ||
|
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