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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF035-05 |
| Certification: | UL and RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 10000/day |
| Delivery Time: | 3-5work days |
| Packaging Details: | 600cc/tube |
| Product name: | Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling |
| Density: | 3.25g/cc |
| Fire rating: | 94-V0 |
| Color: | blue |
| Recommended Operating Temp: | -45-200 ℃ |
| Thermal conductivity: | 3.5 W/mK |
| Shelf Life: | 12 months |
| Keywords: | Thermal gel |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling
TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.
Feature
>Thermal conductivity: 3.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment
| TIF®035-05 Typical Properties | ||
| Property | Value | Test method |
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 30 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 3.25g/c | ASTM D297 |
| Thermal conductivity | 3.5W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.08 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.075 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.1 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us
for confirming.
If you want to know our thermal products, please visit our website.
Company Profile
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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