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| Categories | Multilayer PCB | 
|---|---|
| Brand Name: | XCE | 
| Model Number: | XCEM | 
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL | 
| Place of Origin: | China | 
| MOQ: | 1pcs | 
| Price: | negotiation | 
| Payment Terms: | T/T,Western union | 
| Supply Ability: | 1, 000, 000 PCS / week | 
| Delivery Time: | 5-10 days | 
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box | 
| Material: | rogers+fr4 | 
| Layer: | 4 | 
| Color: | Green | 
| Min line space: | 5mil | 
| Min line width: | 5mil | 
| Copper thickness: | 2OZ | 
| Board size: | 8*6cm | 
| Panel: | 1 | 
| Surface: | ENIG | 
Rogers 3006 Stack Up FR4 4 Layer Multilayer PCB Printed Circuit Board Fabrication
Quick detail:
| Origin:China | Special: 2 raw material mix compression | 
| Layer:4 | Thickness:1.2mm | 
| Surface: ENIG | Hole:0.8 | 
Specification:
RO4350B™ materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.
Typical Applications
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Parameter:
| o | Item | Data | 
| 1 | Layer: | 1 to 24 layers | 
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers | 
| 3 | Board thickness: | 0.20mm to 3.4mm | 
| 4 | Copper thickness: | 0.5 OZ to 4 OZ | 
| 5 | Copper thickness in hole: | >25.0 um (>1mil) | 
| 6 | Max. Board Size: | (580mm×1200mm) | 
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) | 
| 8 | Min. Line Width: | 3mil (0.075mm) | 
| 9 | Min. Line Spacing: | 3mil (0.075mm) | 
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | 
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue | 
| 12 | Shape tolerance: | ±0.13 | 
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 | 
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing | 
| 15 | Certificate: | UL,SGS,ISO 9001:2008 | 
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA | 
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling | 
Features
• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program
Rogers material in stock:
| Brand | Model | Thickness(mm) | DK(ER) | 
| F4B | F4B | 0.38 | 2.2 | 
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 | 
| RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
| RO5880 | 0.254.0.508.0.762 | 2.2 | |
| RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
| RO3010 | 0.635 | 10.2 | |
| RO3206 | 0.635MM | 10.2 | |
| R03035 | 0.508MM | 3.5 | |
| RO6010 | 0.635MM, 1,27MM | 10.2 | 
|   | 
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                     As I know single or doubled sided board is a substrate with copper foil top, and then printed circuit out. But 4layer bo
                                                                                    
                        
                        
                        
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                     Classification of the multilayer circuit board?
                                                                                    
                        
                        
                        
                                                            Classification of the multilayer circuit board?