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| Categories | High Frequency PCB | 
|---|---|
| Brand Name: | XCE | 
| Model Number: | XCEM | 
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL | 
| Place of Origin: | China | 
| MOQ: | 1pcs | 
| Price: | negotiation | 
| Payment Terms: | T/T,Western union | 
| Supply Ability: | 1, 000, 000 PCS / week | 
| Delivery Time: | 5-10 days | 
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box | 
| Material: | Rogers | 
| Layer: | 4 | 
| Color: | Green | 
| Min line space: | 4mil | 
| Min line width: | 4mil | 
| Copper thickness: | 1OZ | 
| Board size: | 105*55mm | 
| Panel: | 1 | 
| Surface: | ENIG | 
5.8G Module Sensor High Frequency PCB Board 4 Layer Rogers Material
Quick detail:
| Origin:China | Special: High frequency pcb | 
| Layer:4 | Thickness:0.79mm | 
| Surface: ENIG | Hole:0.2 | 
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the
products quality ,with high techolonogy treatment improve the life
cycle of the products .Immersion gold surface finish make the pcb
's conductive performance enhancements. Multilayer pcb design ,the
precision of the pcb improves much more better . Low dielectric : 3
dielectric conductivity much more precision .
Typical Applications:
Parameter:
| o | Item | Data | 
| 1 | Layer: | 1 to 24 layers | 
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers | 
| 3 | Board thickness: | 0.20mm to 3.4mm | 
| 4 | Copper thickness: | 0.5 OZ to 4 OZ | 
| 5 | Copper thickness in hole: | >25.0 um (>1mil) | 
| 6 | Max. Board Size: | (580mm×1200mm) | 
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) | 
| 8 | Min. Line Width: | 3mil (0.075mm) | 
| 9 | Min. Line Spacing: | 3mil (0.075mm) | 
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | 
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue | 
| 12 | Shape tolerance: | ±0.13 | 
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 | 
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing | 
| 15 | Certificate: | UL,SGS,ISO 9001:2008 | 
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA | 
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling | 
Features
• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program
Rogers material in stock:
| Brand | Model | Thickness(mm) | DK(ER) | 
| F4B | F4B | 0.38 | 2.2 | 
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 | 
| RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
| RO5880 | 0.254.0.508.0.762 | 2.2 | |
| RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
| RO3010 | 0.635 | 10.2 | |
| RO3206 | 0.635MM | 10.2 | |
| R03035 | 0.508MM | 3.5 | |
| RO6010 | 0.635MM, 1,27MM | 10.2 | 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
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