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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | XCE |
| Model Number: | XCEH |
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin: | China |
| MOQ: | 1pcs |
| Price: | negotiation |
| Payment Terms: | T/T,Western union |
| Supply Ability: | 1, 000, 000 PCS / week |
| Delivery Time: | 5-10 days |
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box |
| Material: | TP-2 |
| Layer: | 2 |
| Color: | gray |
| Min line space: | 5mil |
| Min line width: | 5mil |
| Copper thickness: | 1OZ |
8MM Thickness TP-2 High Frequency PCB Boards In Transportation System
Specification:
Board size: 3*3 cm
Board thickness: 8mm
Copper foil: 100UM
Surface: Immersion gold
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Choosing high frequency pcb material :
Selecting a circuit material for a high-frequency printed-circuit
board(pcb) is generally a trade-off,often between price and
performance.However,PCB materials are also selected by two key
factors: how well they meet the needs of an end-use application and
what kind of efforts is required to fabricate a desired circuit
with a particular material.
These two factors may not mesh:one material may be well suited for
a particular application but may pose challenges in terms of
circuit fabrication,and vice verse.There is no foolproof,step by
step procedure for selecting a PCB material.But by relying on some
tangible guildelines designed to evaluate a material in terms of
its suitability for circuit fabrication and for meeting the
requirements of an application,the process of selecting a PCB for a
particaular application can be simplied.
Application:
Telecom:transmitter.receiver.oscillator.antenna
Satellite receiver
Global location system,amplifier.satellite telecom
Microwave transmission
Automobile telephone
Measure apparatus.LSI inspector.analyser.signal oscillator
High frequency telecom.high speed transmission high security.
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