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| Categories | Rectangular Connectors |
|---|---|
| MOQ: | 648 |
| Brand Name: | 2-5499206-1 |
| Description: | Through Hole FFC, FPC (Flat Flexible) Connector Housings RoHS |
| Model Number: | 2-5499206-1 |
| Packaging Details: | Through Hole |
| Stock: | 64800 |
| Delivery Time: | 25-42周 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This specification covers performance, tests, and quality requirements for AMP-LATCH* universal and low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical assemblies. The product is designed to meet electrical, mechanical, and environmental performance requirements.
| Specification | Requirement | Procedure |
|---|---|---|
| Insulation resistance | 5000 megohms minimum initial. 1000 megohms minimum final. | EIA-364-21. 500 volts DC, 2 minute hold. Test between adjacent contacts of unmated specimens. |
| Withstanding voltage | One minute hold with no breakdown or flashover. 1000 volts AC at sea level. | EIA-364-20, Condition I. Test between adjacent contacts of unmated specimens. |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | TE Spec 109-11-1. Subject contacts to solderability for specimens with tin-lead plated soldertails. TE Spec 109-11-11. Subject contacts to solderability for specimens with lead-free tin plated soldertails. |
| Component resistance to wave soldering | See Note. | TE Spec 109-202, Condition A. 240C for specimens with tin-lead plated soldertails. TE Spec 109-202, Condition B. 265C for specimens with lead-free tin plated soldertails. |
| Contact retention | Post shall not dislodge from normal position. | EIA-364-29, Method A. Apply axial load of 2 pounds to contacts and hold for 6 seconds. See Figure 3. |
| Thermal shock | See Note. | EIA-364-32, Test Condition II. Subject unmated specimens to 5 cycles between -65 and 105C with 30 minute dwells at temperature extremes. |
| Humidity/temperature cycling | See Note. | EIA-364-31, Method III. Subject unmated specimens to 10 cycles (10 days) between 25 and 65C at 80 to 100% RH with cold shock. Shall meet visual requirements, show no physical damage and shall meet requirements of NOTE additional tests as specified in Test Sequence in Figure 2. |
| Test or Examination | Test Group | Test Sequence |
|---|---|---|
| Examination of product | 1,3,5 | 1,3 |
| Insulation resistance | 2,6 | 1,8 |
| W ithstanding voltage | 3,7 | 2 |
| Solderability | 2 | Component resistance to wave soldering |
| Contact retention | 4 | Thermal shock |
| Humidity/temperature cycling | 5 |
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