| Part Number | AFA01-S**FCA-00 |
| Rated Voltage (MAX) | 50V AC/DC |
| Rated Current (MAX) | 0.4A AC/DC (Document 1), 0.5A AC/DC (Document 2) |
| Temperature Range | -45C to +85C |
| Contact Resistance | 20m MAX (Document 1), 20 m MAX (Document 2) |
| Insulation Resistance | 500M (Document 1), 500M MIN (Document 2) |
| Withstanding Voltage | 200V AC/minute (Document 1), No Breakdown (Document 2) |
| Locking Force (N) | 1.96*n MAX |
| Withdrawal Force (N) | 0.49*n MIN |
| Terminal Retention Force (N) | 3.92N MIN |
| Repeated Insertion/Withdrawal Cycles | 20 cycles |
| Contact Resistance after Repeated Insertion/Withdrawal | 60 m MAX |
| Temperature Rise | 30 MAX |
| Vibration Resistance (Discontinuity) | 1 ms MAX |
| Shock Resistance (Discontinuity) | 1 ms MAX |
| Heat Resistance (Contact Resistance) | 60 m MAX |
| Cold Resistance (Contact Resistance) | 60 m MAX |
| Humidity Resistance (Insulation Resistance) | 20 M MIN |
| Temperature Cycling (Contact Resistance) | 60 m MAX |
| Salt Spray Resistance (Contact Resistance) | 60 m MAX |
| SO2 Gas Resistance (Contact Resistance) | 60 m MAX |
| NH3 Gas Resistance (Contact Resistance) | 60 m MAX |
| Solderability (Wetting Area) | 95% or more |
| Resistance to Soldering Heat (Appearance) | No damage, deformation |
| PC Board Layout (Example for 4 Circuits) | A: 3.00, B: 5.10, C: 8.30, D: 9.90 |
| PC Board Layout (Example for 25 Circuits) | A: 24.00, B: 26.10, C: 29.30, D: 30.90 |
| CKTS (Contacts) | Variable (e.g., 4p-10p, 9p-15p, etc.) |
| PLATING | Gold flash 1u", 2u", 3u" |
| PACKING | Tape&Reel (B:Bright-Tin, C:Matt-Tin), Tube |
| Tape Color | Black, Transparent |
| Sealing Method | Heat Seal, Cold Seal |