Product Overview
The MILLIPACS 2mm HARD METRIC SERIES Vertical Header Connectors
offer a modular, board-to-board and cable-to-board interconnection
system designed in accordance with IEC 917, IEC 61076-4-101, and
Telcordia GR-1217-CORE standards. This 2mm Hard Metric (HM)
connector system is a popular choice for backplane applications,
providing cost-effectiveness, user flexibility, standardization,
and broad availability. It is extensively used in chassis-based
packaging for the communications, data, medical, and industrial &
instrumentation segments. The series features vertical headers
available in standard signal modules of 5 and 8 rows, supporting up
to 125 signal contacts (5-row) and 200 signal contacts (8-row) per
50mm length. Hybrid modules with signal, power, and coax contacts
are also available. These vertical headers mate with right-angle
receptacles, vertical receptacles, and cable connectors via a
shroud, offering features like adequate spacing for PCB trace
routing, modularity, and various mating contact lengths.
Product Attributes
- Brand: MILLIPACS
- Pitch: 2mm
- Configuration: Hard Metric (HM)
- Standards Compliance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE
1301
- Insulator Material: Thermoplastic UL94V0 (standard press-fit), High-Temperature
polymer (Pin-in-paste terminations)
- Contact Material: Copper Alloy
- Contact Plating: Gold / Palladium nickel on mating area, Tin over Nickel on
press-fit/pinin-paste terminal area
- Approvals & Certifications: UL and CSA recognized
- Packaging: Tray Packaging (standard versions), Tape and reel packaging
(Pin-in-paste versions)
Technical Specifications
| Header Series | Type | Max. No. of Signal Pins | Mounting Style | Features | Part Number |
|---|
| HM2P07P | 5 | 110 | Press-fit | 22 column, 50mm + MPC + location peg | |
| HM2P29P | 5 | 110 | Press-fit | 22 column, 50mm + MPC + Guide pin option + location peg | |
| HM2P27P | 5 | 60 | Press-fit | 12 column, 30mm + MPC + location peg | |
| HM2P40P | 5 | 110 | Press-fit | 22 column, 50mm + MPC | |
| HM2P08P | 5 | 125 | Press-fit | 25 column, 50mm | |
| HM2P70P | 5 | 110 | Press-fit | 22 column, 44mm | |
| HM2P71P | 5 | 95 | Press-fit | 19 column, 38mm | |
| HM2P65P | 5 | 125 | Press-fit | 25 column, 50mm + polarization on housing walls | |
| HM2P66P | 5 | 110 | Press-fit | 22 column, 44mm + polarization on housing walls | |
| HM2P67P | 5 | 95 | Press-fit | 19 column, 38mm + polarization on housing walls | |
| HM2P09P | 5 | 55 | Press-fit | 11 column, 25mm + end polarization + location peg | |
| HM2P80P | 5 | 55 | Press-fit | 11 column, 25mm + reversed + end polarization + location peg | |
| HM2A30P | 5 | 6 | Spl. Press-fit | 50mm, 6 power/coax + MPC | |
| HM2P11P | 5 | 55 | Spl. + Press-fit | 50mm, 55 signal + 3 power/coax + MPC | |
| HM2A32P | 5 | 3 | Spl. Press-fit | 25 mm, 3 power/coax + end polarization | |
| HM2P87P | 8 | 176 | Press-fit | 22 column, 50mm + MPC + guide pin option + location peg | |
| HM2P95P | 8 | 200 | Press-fit | 25 column, 50mm + polarization on walls | |
| HM2P88P | 8 | 200 | Press-fit | 25 column, 50mm | |
| HM2P89P | 8 | 88 | Press-fit | 11 column, 25mm + end polarization + location peg | |
| HM2P40S | 5 | 110 | Pin-in-paste | 22 column, 50 mm + MPC | |
| HM2P09S | 5 | 55 | Pin-in-paste | 11 column, 25mm + end polarization + location peg | |
| HM2P11S | 5 | 55 | Spl. + Pin-in-paste | 50 mm, 55 signal + 3 power/coax + MPC | |
| Electrical Performances |
| Operating Current | 1.5 A at 20C; 1.0 A at 70C |
| Test Voltage | 750 Vrms |
| Contact Resistance | 20 m max |
| Insulation Resistance | 104 M min |
| Mechanical Performance |
| Mating Force | 0.75 N max per contact pair |
| Withdrawal Force | 0.15 N min per contact pair |
| Hertz Stress | 200 Kpsi min |
| Misalignment | Longitudinal 2.0mm; Transversal 2.5mm |
| Inclination | 2.0 |
| Environmental |
| Operating Temperature | -55C to +125C |
| Specifications |
| Product Specification | GS-12-203 |
| Application Specification | GS-20-034 |
Target Markets/Applications: Communications (IP, LAN/WAN, Core Switches, Routers, Hubs, Base
Stations, Transmission Access Systems), Data (Servers, Storage
Units), Industrial & Instrumentation (Data Acquisition, Railway
Traffic Management, Control Systems, Energy & Power, Avionics,
Digital Image Processing, Multimedia, Signage, Video Surveillance,
Radar, Sonar Systems, UAV), Medical (MRI Scanners, Diagnostic
Equipment).
