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| Categories | Memory Connectors |
|---|---|
| Card Connection Mode: | Push-Pull |
| Card Type: | MicroSD Card (TF Card) |
| Brand Name: | TF-128-ARP9 |
| Packaging Details: | SMD |
| Delivery Time: | 12-17工作日 |
| Connector Type: | Connector and Ejector |
| Operating Temperature: | -25℃~+60℃ |
| MOQ: | 2500 |
| Model Number: | TF-128-ARP9 |
| Description: | Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount |
| Stock: | 5000 |
| Height Above Board: | 1.15mm |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product is a Micro SD H1.15 Card Connector designed for various applications. It features a high-temperature thermoplastic housing (LCP MG350) in black, UL 94V-0 rated. The connector is ROHS compliant and meets ELV 2000/53/EC directives. It is suitable for use with metal parts thicker than 0.15mm and has undergone rigorous testing for mating cycles and environmental conditions. The product also includes card detection and switch functionalities.
Unspecified
DongGuan XunPu Electronics Co,Ltd
Housing: High Temperature Thermaplastic (LCP MG350), Contact: Phosphor Bronze (C5210R-SH), Cover: SUS304-H
Black
ROHS Compliant, ELV 2000/53/EC
TF Card Connector
TF-128-ARP9
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Contact Current Rating | 0.5 | Amperes | |
| Dielectric Withstanding Voltage | 250 | V r.m.s | |
| Insulation Resistance | 1000 | Megohms Minimum At DC 500V | |
| Contact Resistance | 100 | m Maximum | |
| Mating Cycles | 5,000 | Cycles | |
| Operating Temperature | -25 to +60 | C | |
| Housing Material | High Temperature Thermaplastic (LCP MG350) | Color Black UL 94V-0 | |
| Contact Material | Phosphor Bronze (C5210R-SH) | T=0.12mm | |
| Cover Material | SUS304-H | T=0.10mm | |
| Contact Plating (Contact Area) | 2 | " Min | Gold |
| Contact Plating (Middle) | 8 | min | Pd=Ni |
| Contact Plating (Solder Area) | 1 | Min | Gold |
| Contact Plating (Underplating) | 80 | Min | Ni overall |
| Cover Plating (Underplating) | 30 | U" Min | Ni overall |
| Cover Plating (Solder Area) | 1 | Min | Gold |
| Pitch (Connector Center) | 0.70 | mm | |
| Pitch (Card Detection) | 0.70 | mm | |
| Pitch (Card Detection) | 0.70 | mm | |
| Card Detection Function | Yes | When become a card | |
| Switch Function | Yes | ||
| Compliance | RoHS Directive 2002/95/EC and ELV 2000/53/EC | ||
| Specification Compliance | Taisol HF WD-3-I-091 | ||
| Recommended Metal Thickness | > 0.15 | mm | For solderability confirmation |
| PIN NO. | NAME | TYPE | DESCRIPTION |
|---|---|---|---|
| 1 | CD/DAT2 | I/O/PP | CARD DETECT DATE LINE(BIT2) |
| 2 | CD/DAT3 | I/O/PP | CARD DETECT DATE LINE(BIT3) |
| 3 | CD | I/O/PP | COMMAND RESPONSE |
| 4 | VOD | SUPPLY VOLTAGE | |
| 5 | CLK | CLOCK | |
| 6 | Vss | SUPPLY VOLTAGE GROUND | |
| 7 | DAT0 | I/O/PP | DATE LINE(BMO) |
| 8 | DAT1 | I/O/PP | DATE LINE(DITT) |
| 9-12 | GND |
|
