TE Connectivity 2-87608-1

Product Overview

The TE Connectivity AMPMODU Headers 2-87608-1 is a vertical, board-to-board PCB mount header designed for parallel configurations. It features a fully shrouded design with 50 positions and a 2.54 mm [.1 in] centerline pitch. This header is constructed with gold-plated contacts over a nickel-plated copper alloy, ensuring reliable signal transmission with a maximum current rating of 3 A. The through-hole solder termination method provides a secure connection to the PCB. Ideal for signal applications, this header offers robust mechanical features including detent window mating retention and polarization for accurate assembly.

Product Attributes

• Brand: TE Connectivity
• Series: AMPMODU Headers
• Internal #: 2-87608-1
• Product Type: PCB Mount Header
• Connector System: Board-to-Board
• Housing Material: Nylon-GF
• Primary Product Color: Black
• Contact Base Material: Phosphor Bronze
• Contact Mating Area Plating Material: Gold
• Contact Underplating Material: Nickel
• Contact Type: Pin
• Termination Method to Printed Circuit Board: Through Hole - Solder
• Mating Retention Type: Detent Window
• Mating Alignment Type: Polarization
• Housing Temperature Rating: Standard
• Agency/Standard: CSA, UL
• UL Flammability Rating: UL 94V-0
• Packaging Quantity: 24
• Packaging Type: Tray
• EU RoHS Directive: 2011/65/EU Compliant
• EU ELV Directive: 2000/53/EC Compliant
• China RoHS 2 Directive: MIIT Order No 32, 2016
• EU REACH Regulation: Compliant (No Restricted Materials Above Threshold)
• Halogen Content: BFR/CFR/PVC Free, but Br/Cl >900 ppm in other sources.
• Solder Process Capability: Wave solder capable to 240C

Technical Specifications