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| Categories | NTC Thermistors |
|---|---|
| Resistance @ 25℃: | 100kΩ |
| Power(Watts): | 200mW |
| Operating Temperature: | -55℃~+125℃ |
| Tolerance: | ±5% |
| Steady State Current (Max): | 140uA |
| Thermal Time Constant: | 5s |
| B Constant Tolerance: | ±3% |
| B Constant (25℃/50℃): | 3950K |
| Description: | NTC Thermistor 100kΩ Surface Mount 0805 |
| Mfr. Part #: | RL0805N104J3950H |
| Model Number: | RL0805N104J3950H |
| Package: | 0805 |
| Company Info. |
| Changsha Purple Horn E-Commerce Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This document outlines the reliability tests, packaging, storage, transportation, and recommended soldering technologies for Chip NTC Thermistors. These components are designed for applications requiring precise temperature sensing and stability under various environmental conditions.
RUILZ:N ELECTRONICS
Chip NTC Thermistor
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | No removal or split of the termination or other defects shall occur. | Solder the chip to the testing jig (glass epoxy board shown in Fig. 5.4.1-1) using eutectic solder. Then apply a force in the direction of the arrow. 2N force for 0603 series, 5N force for 1005 and 1608 series, 10N force for 2012 series. Keep time: 10+1s. |
| Resistance to Flexure | No visible mechanical damage. | Solder the chip to the test jig (glass epoxy board shown in Fig. 5.4.2-1) using a eutectic solder. Then apply a force in the direction shown in Fig. 5.4.2-2. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Vibration | No visible mechanical damage. | Solder the chip to the testing jig (glass epoxy board shown in Fig. 5.4.3-1) using eutectic solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency ranging from 10 to 55 Hz and returning to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). |
| Dropping | No visible mechanical damage. | Drop chip inductor 10 times on a concrete floor from a height of 100. |
| Solderability | No visible mechanical damage. Wetting shall exceed 80% coverage. | Solder temperature: 240+2C. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Resistance to Soldering Heat | No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%. | Solder temperature: 260+3C. Duration: 5 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Thermal Shock | No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%. | Temperature: -55C 30 min. -> Ambient -> 125C 30 min. Transforming interval: 20sec. (max.). Tested cycle: 100 cycles. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Low Temperature | No visible mechanical damage. Resistance to R25 change: within +5%. Low B Constant change: within +2%. | Temperature: -55+2C. Duration: 1000* hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Resistance to High Temperature | No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%. | Temperature: 125+2C. Duration: 1000* hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%. | Temperature: 60+2C. Humidity: 90% to 95% RH. Duration: 1000** hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Loading at High Temperature (Life Test) | No visible mechanical damage. R25 change: Within +5%. B constant change: Within +2%. | Temperature: 85+2C. Duration: 1000 hours. Applied current: Max. Permissive Operating Current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. |
| Packaging Code | Type | T (mm) | Quantity |
|---|---|---|---|
| T | 0603[0201] | 0.30.05 | 15K |
| T | 1005[0402] | 0.50.15 | 10K |
| T | 1608[0603] | 0.80.15 | 4K |
| T | 2012[0805] | 0.850.2 | 4K |
| Type | A (mm) | B (mm) | P (mm) | Tmax (mm) |
|---|---|---|---|---|
| 0603[0201] | 0.400.1 | 0.700.1 | 2.00.05 | 0.55 |
| 1005[0402] | 0.650.1 | 1.150.1 | 2.00.05 | 0.8 |
| 1608[0603] | 1.00.2 | 1.80.2 | 4.00.1 | 1.1 |
| 2012[0805] | 1.50.2 | 2.30.2 | 4.00.1 | 1.1 |
| Storage Condition | Details |
|---|---|
| Humidity | Store at 40C or less and 70% RH or less. |
| Atmosphere | Avoid storage in environments exposed to dust or harmful gases (e.g., HCl, sulfurous gas of H2S). |
| Sunlight | Prevent exposure to direct sunlight to avoid deformation of packaging material. |
| Shelf Life | Solderability guaranteed for 3 months from the date of delivery under specified storage conditions. Parts exceeding 3 months should have solderability checked before use. |
| Parameter | Profile |
|---|---|
| Preheat Condition | 150 ~200C/60~120sec. |
| Peak Temperature | 260C max |
| Allowed Time Above 217C | 60~90sec. |
| Max Time at Max Temp | 10sec. |
| Solder Paste | Sn/3.0Ag/0.5Cu |
| Max Ramp Down Rate | 6C/sec |
| Allowed Reflow Time | 2x max 200C |
| Max Ramp Up Rate | 3C/sec. |
|
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