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Double-Sided Copper Clad Laminate with Astra MT77 Material using in long antennas and radar applications for automobiles

Categories Bicheng Newly shipped PCB
Brand Name: Astra MT77
Model Number: Astra MT77
Certification: ISO9001
Place of Origin: China
MOQ: 1PCS
Price: 0.99-99USD/PCS
Payment Terms: T/T, Paypal
Supply Ability: 50000pcs
Delivery Time: 2-10 working days
Packaging Details: Packing
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Double-Sided Copper Clad Laminate with Astra MT77 Material using in long antennas and radar applications for automobiles

Double-Sided Copper Clad Laminate with Astra MT77 Material


This double-sided copper clad laminate, built using Astra MT77, is a premium solution for high-performance RF and millimeter-wave applications. Designed for applications requiring exceptional signal integrity and low-loss performance, this laminate is suitable for radar, automotive electronics, and high-frequency RF systems. Its combination of stable dielectric properties, thermal reliability, and manufacturing efficiency makes it a standout choice for demanding industries.



Key Material Details

ParameterSpecification
Base MaterialAstra MT77
Copper LayersDouble-sided, 1oz (35μm)
Dielectric Thickness0.254mm (10mil)
Finished Laminate Thickness0.33mm
Surface FinishImmersion Gold (ENIG)
Minimum Trace/Space4/4 mils
Minimum Hole Size0.2mm
Via Plating Thickness20μm
Solder MaskTop: Green, Bottom: Green
SilkscreenTop: White, Bottom: None

Key Features of Astra MT77:

Dielectric Constant (Dk): 3.0 at 2GHz and 10GHz, ensuring stable signal transmission over a wide frequency range.

Dissipation Factor (Df): Ultra-low 0.0017, minimizing signal loss at high frequencies and improving efficiency for RF and millimeter-wave circuits.

Thermal Stability: High Tg of 200°C and thermal decomposition temperature (Td) of 410°C, ensuring reliable performance under extreme conditions.

Moisture Resistance: Low moisture absorption (0.1%), ensuring dimensional stability and electrical consistency even in humid environments.

CTE (Coefficient of Thermal Expansion): X/Y-axis: 12 ppm/°C, Z-axis: 250-350 ppm/°C
Ensures stable performance and excellent plated through-hole (PTH) reliability during thermal cycling.


Advantages of This Double-Sided Copper Clad Laminate


  1. The stable Dk and ultra-low Df of Astra MT77 ensure minimal signal loss, making it ideal for high-frequency and millimeter-wave applications, such as 77GHz automotive radar.
  2. With a high Tg of 200°C and low Z-axis CTE, this laminate offers excellent thermal stability and dimensional reliability during high-temperature processes and operation.
  3. The laminate’s peel strength (5.7 lb/inch) ensures robust copper adhesion, even during repeated thermal stress.
  4. Astra MT77 is FR-4 process compatible, allowing standard manufacturing techniques to be used without the need for specialized equipment. This reduces production costs and simplifies manufacturing for RF designs.
  5. Features such as short lamination cycles, good flow and fill, and no requirement for plasma desmear further enhance production efficiency.
  6. At just 0.33mm thick, this laminate is ideal for compact, space-constrained applications while maintaining the robustness needed for high-frequency circuits.

Applications of Astra MT77 Double-Sided Copper Clad Laminate


Automotive Radar Systems

Adaptive Cruise Control (ACC)

Blind Spot Detection (BSD)

Lane Departure Warning Systems

Pre-Crash Warning Systems


Processing Advantages

  • FR-4 Compatibility: Can be processed using standard FR-4 manufacturing equipment, reducing costs and simplifying production.
  • Short Lamination Cycles: Reduces manufacturing time and increases throughput.
  • Reduced Drill Wear: Improves tool life and enhances production efficiency.
  • No Plasma Desmear Required: Simplifies the via preparation process.
  • Dimensional Stability: Ensures consistent results even after multiple lamination cycles.
  • Lead-Free Solder Compatibility: Fully compatible with modern lead-free soldering processes.

Conclusion

This double-sided copper clad laminate with Astra MT77 is a high-performance solution for RF and microwave designs requiring excellent signal integrity, low loss, and thermal reliability. Its FR-4 compatibility and cost-effectiveness make it an attractive alternative to PTFE-based materials for high-frequency applications. However, its focus on specialized RF applications and limited layer count may restrict its use in general-purpose or complex designs.


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