Sign In | Join Free | My futurenowinc.com
futurenowinc.com
Products
Search by Category
Home > Quartz Products >

4inch 4H-Semi HPSI SiC Wafer for Semiconductor and Electronics

Categories Silicon Carbide Wafer
Brand Name: ZMSH
Model Number: 4inch 4H-Semi SiC Wafer
Certification: RoHS
Place of Origin: China
MOQ: 10pieces
Payment Terms: T/T
Delivery Time: 2-4weeks
Packaging Details: Customizable Package
Diameter: 4inch, 99.5 mm~ 100.0 mm
Grade: Dummy / Research /Production Grade
Type: SiC High Purity Single Crystal 4H-semi Type
Thickness: 500 μm±25 μm
Warp: ≤40 μm
Roughness: Ra≤1 nm
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

4inch 4H-Semi HPSI SiC Wafer for Semiconductor and Electronics

4inch 4H-Semi HPSI SiC Wafer for Semiconductor and Electronics

What Are SiC Wafers and What Are They Used For?

Silicon Carbide (SiC) wafers are semiconductor substrates made from a compound of silicon and carbon. SiC is a wide bandgap semiconductor, unlike wafer manufacturing with simple silicon, which means it can operate under extreme conditions, including high temperatures, high voltages, and high frequencies. This makes SiC wafers ideal for demanding electronic applications.

Introduction of 4H Semi-Insulating SiC Wafer:

4H Semi-Insulating Silicon Carbide (SiC) wafers are high-purity, high-resistivity single-crystal substrates made from the 4H polytype of silicon carbide. They are designed primarily for radio frequency (RF), microwave, 5G communication, and power electronics isolation applications, where excellent electrical insulation, low loss, and high thermal conductivity are essential. 4H Semi-Insulating SiC wafers combine wide bandgap energy, high thermal conductivity, and high resistivity, making them ideal substrates for RF, microwave, and high-frequency communication devices. Their excellent isolation performance and thermal stability enable the production of next-generation high-power and high-frequency systems, supporting industries such as 5G, aerospace, and advanced electronics.

Specification of ZMSH 4inch 4H-Semi Sic Substrates:

Specification of 4 inch diameter 4H-Semi Silicon Carbide (SiC) Substrate
Grade
Zero
MPD
Production

Standard
Production
Grade(P
Grade)

Dummy
Grade
(D
Grade)
Diameter99.5 mm~ 100.0 mm
Thickness4H-Semi500 μm±15 μm500 μm±25 μm
Wafer OrientationOff axis : 4.0° toward <1120 > ±0.5° for 4H-N, On axis : <0001>±0.5° for 4H-SI
Micropipe Density4H-Semi≤ 1cm-2≤ 5 cm-2≤15 cm-2
Resistivity4H-Semi1E10 Ω·cm1E5 Ω·cm
Primary Flat Orientation{10-10} ±5.0°
Primary Flat Length32.5 mm ± 2.0 mm
Secondary Flat Length18.0 mm ± 2.0 mm
Secondary Flat OrientationSilicon face up: 90° CW. from Prime flat ±5.0°
Edge Exclusion3 mm
LTV/TTV/Bow /Warp≤2.5 μm/≤5 μm/≤15 μm/≤30 μm≤10 μm/≤15 μm/≤25 μm/≤40 μm
RoughnessPolish Ra≤1 nm
CMP Ra≤0.2 nmRa≤0.5 nm
Edge Cracks By High Intensity LightNoneCumulative length ≤ 10 mm, single length≤2 mm
Hex Plates By High Intensity LightCumulative area 0.05%Cumulative area ≤0.1%
Polytype Areas By High Intensity LightNoneCumulative area≤3%
Visual Carbon InclusionsCumulative area 0.05%Cumulative area ≤3%

Silicon Surface Scratches By High Intensity Light
NoneCumulative length≤1×wafer diameter
Edge Chips High By Intensity LightNone permitted ≥0.2 mm width and depth5 allowed, ≤1 mm each

Silicon Surface Contamination By High Intensity
None
Threading Screw Dislocation500 cm-2N/A
PackageMulti-wafer Cassette Or Single Wafer Container



Key Advantages of Sic Wafers and Substrates:

Wider Bandgap:
A larger bandgap ensures that electrons are less likely to be thermally excited at high temperatures, resulting in weaker intrinsic excitation and better high-temperature tolerance. The bandgap of silicon carbide (SiC) is about three times wider than that of silicon, allowing a theoretical operating temperature above 400 °C.

High Critical Breakdown Field:
The critical electric field refers to the field strength at which a material undergoes electrical breakdown. Beyond this point, it loses its insulating properties — a key factor in determining voltage resistance. SiC’s critical breakdown field is about ten times higher than that of silicon, enabling it to withstand higher voltages and making it ideal for high-voltage devices.

Excellent Thermal Conductivity:
High temperature is one of the main factors affecting device lifespan. Thermal conductivity represents a material’s ability to transfer heat. SiC’s high thermal conductivity allows efficient heat dissipation, reducing device temperature and maintaining stable operation.

High Saturated Electron Drift Velocity:
The saturated electron drift velocity refers to the maximum directional speed of electrons in a semiconductor. This value determines the switching frequency of a device. SiC’s drift velocity is about twice that of silicon, which helps achieve higher operating frequencies and enables device miniaturization.

Application of 4H Semi-insulating SiC Crystal Substrate and Wafer:

Slicon carbide (SiC) crytsals have unique physical and electronic properties. Sic-based devices have been used for short-wavelenath photoelectricilyhioh-temperalure, anli-radiaion applications,. High power and hiah freqency electronic devices made ftom semiinsulating siicon carbide substrates aresuperior to those based on Si and GaAs, and 4H semiinsulaing Sic wafers are mainly used in Power device and RF device. Moreover, it can be usedas caiers for temporary bonding. For transparent semiinsulated Sic substrate, it has a transparent rate around 70% and is suitable for heat dissiationoptics.


ZMSH Related SiC Wafer Recommendation:

High Purity Silicon Carbide Wafer Prime/Dummy/Ultra Grade 4H-Semi SiC Wafers For 5G Device

Q&A:

Q: What is a SiC wafer?

A: A SiC wafer — short for Silicon Carbide wafer — is a single-crystal substrate made from silicon (Si) and carbon (C) atoms. It is one of the most important wide-bandgap semiconductor materials used in next-generation power electronics, RF devices, and high-temperature applications. A SiC wafer is a high-performance semiconductor substrate known for its wide bandgap, superior heat conductivity, and high voltage endurance. It enables smaller, faster, and more energy-efficient electronic devices — powering the future of electric vehicles, renewable energy systems, and advanced communication technologies.

Q:What is the difference between SI wafer and SiC wafer?

A: Silicon wafers are ideal for general-purpose electronics — affordable and reliable for low-to-medium power devices. SiC wafers, as wide-bandgap semiconductors, excel in high-power, high-voltage, and high-temperature environments, enabling faster, smaller, and more efficient power electronics.

Q: Which is better, SiC or GaN?

A: SiC (Silicon Carbide) is best for high-power, high-voltage, high-temperature applications such as electric vehicles, rail transit, and renewable energy.GaN (Gallium Nitride) excels in high-frequency, low-to-medium voltage applications like fast chargers, RF amplifiers, and 5G systems.

Quality 4inch 4H-Semi HPSI SiC Wafer for Semiconductor and Electronics for sale
Send your message to this supplier
 
*From:
*To: SHANGHAI FAMOUS TRADE CO.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0