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| Categories | Ceramic Arm |
|---|---|
| Brand Name: | Dayoo |
| Place of Origin: | Made In China |
| Functionality: | Multi-purpose |
| Operating System: | Compatible with various systems |
| Flexibility: | High |
| Printing Technology: | 3D Printing |
| Durability: | High |
| Power Source: | Electricity |
| Precision: | High |
| Arm Length: | Adjustable |
| Speed: | Fast |
| Weight: | Lightweight |
| Control Method: | Robotic |
| Material: | Ceramic |
| Color: | White |
| Design: | Sleek and modern |
| Company Info. |
| Dayoo Advanced Ceramic Co.,Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
The 3D-printed alumina ceramic robotic arm is a high-performance automation solution specifically designed for semiconductor manufacturing, wafer handling, and automated production. Utilizing DLP/SLA 3D printing technology, it is manufactured as a single integrated component from 99.9% high-purity alumina ceramic (Al₂O₃). With exceptional properties including ultra-high hardness, thermal resistance, corrosion resistance, and low thermal expansion coefficient, it is ideal for vacuum environments, harsh chemical conditions, and high-temperature processes, ensuring high cleanliness and stability in wafer handling applications.
Key Applications
✅ Semiconductor wafer handling: Vacuum gripping, positioning and transfer of 12-inch wafers
✅ Etching & deposition equipment: Plasma-resistant for PVD/CVD processes
✅ High-temperature operations: Continuous operation at 300°C+
✅ Automated production lines: Compatible with end-of-arm tooling (EOAT) for enhanced
productivity
| Feature | Traditional Metal Arms | 3D-Printed Ceramic Arm |
|---|---|---|
| Corrosion Resistance | Vulnerable to acids/alkalis | Resists pH 1-14 environments |
| Thermal Stability | Deforms above 200°C | Stable at 300°C+ |
| Weight | Heavy (steel construction) | Lightweight (3.9g/cm³ density) |
| Cleanliness | Metal particle contamination | Zero particle emission, SEMI-compliant |
Material Purity: ≥99.9% Al₂O₃
Printing Technology: DLP photopolymerization (±20μm precision)
Payload Capacity: 5kg (standard)/10kg (heavy-duty)
Repeatability: ±0.01mm positioning accuracy
Temperature Range: -50°C to 300°C
Surface Roughness: Ra≤0.1μm (polishable to 0.05μm)
Vacuum Compatibility: Integrated air channels (0.5μm filtration)
3D Modeling: CAD design + wafer handling path simulation
Slurry Preparation: Nano-alumina + photopolymer resin mix (55-58% solid content)
DLP Printing: Layer-by-layer curing (20μm thickness)
High-Temp Sintering: 1650°C densification (117-122% shrinkage compensation)
Precision Machining: Laser trimming + CNC grinding (±0.02mm flatness)
Quality Control: X-ray inspection + leak testing
⚠ Important Notes:
Autoclave sterilize (121°C) before first use
Avoid hydrofluoric acid (HF) exposure
Monthly joint inspection for wear and vacuum integrity
Use ceramic end-effectors to prevent wafer damage
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