OSP Blue Oil Double Sided Printed Circuit Board
OSP blue oil double panel is a double-sided printed circuit board that combines OSP (Organic Solderability Preservative) surface treatment with a blue solder mask. It features a double-sided wiring design:
the substrate is coated with blue ink as the solder mask, which
provides insulation, protects the circuit, and allows for clear
visual identification of circuit areas due to its distinct color.
Both sides of the board undergo OSP treatment on exposed copper
surfaces, forming a thin organic protective film through chemical
reactions to prevent copper oxidation while maintaining
solderability. This panel is suitable for small to medium
complexity circuits and adapts to the welding needs of conventional
and precision components.
Key Advantages of Anti-Oxidation Blue Solder Mask Double-Sided PCBs
1. Superior Oxidation Resistance:The specialized anti-oxidation coating, combined with the blue
solder mask, provides robust protection for copper traces,
preventing oxidation and corrosion in humid or harsh environments.
2. Enhanced Visual Contrast:The blue solder mask offers clear contrast against silver or tin
surface finishes (e.g., HASL, ENIG) and component labels,
simplifying visual inspection, debugging, and manual soldering.
3. Reliable Insulation & Protection:The solder mask effectively insulates copper layers to avoid short
circuits, while shielding the board from dust, moisture, and
mechanical wear during assembly and operation.
4. Balanced Cost & Performance:As a double-sided structure with a mature blue solder mask process,
it maintains cost-effectiveness for medium-volume production,
suitable for low-to-medium frequency electronic devices.
Main Manufacturing Process of Anti-Oxidation Blue Solder Mask
Double-Sided PCBs
1. Substrate Preparation:Cut FR-4 epoxy laminate (the base material) into standard-sized
boards, and clean their surfaces to remove dust, oil, or impurities
for subsequent copper bonding.
2. Copper Cladding & Patterning:Laminate copper foils onto both sides of the substrate. Then, use
photolithography: coat the copper layer with photoresist, expose it
to UV light through a circuit mask, and etch away unexposed copper
to form the desired circuit traces.
3. Drilling & Plating:Drill through-holes (PTHs) to connect circuits on both sides. Plate
the holes with copper via electroplating to ensure electrical
conductivity between the top and bottom layers.
4. Blue Solder Mask Application:Screen-print or spray blue solder mask ink onto the board surface.
Cure it under UV light to form a protective layer, leaving only
pads and holes exposed for soldering.
5. Anti-Oxidation Surface Finishing:Apply an anti-oxidation coating (e.g., chemical treatment or
specialized film) on exposed copper pads. Common finishes like HASL
(Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion
Gold) are often used to enhance oxidation resistance.
6. Silkscreen Printing & Curing:Print component labels, reference marks, and logos on the blue
solder mask layer using white or black ink, then cure it to fix the
markings.
7. Electrical & Visual Inspection:Conduct electrical tests (e.g., continuity, insulation resistance)
to check circuit functionality. Perform visual inspections to
ensure solder mask uniformity, pattern accuracy, and no defects
like bubbles or scratches.
8. Final Cutting & Packaging:Cut the multi-panel board into individual PCBs according to design
specifications, then clean and package them to prevent damage
during transportation.
Double Sided Blue Oil Half Hole Plate PCB FR4 Material Multilayer Design
