FR4 1.2mm Thinkness High Density PCB Multi Level Design

High-density PCB

Product Description:

High-density PCB refers to a printed circuit board with higher circuit density, smaller aperture and thinner lines. Compared with traditional PCBs, high-density PCB designs enable more circuit connections in the same space, adapting to the needs of miniaturized, high-performance electronic products. High-density PCB can achieve higher integration and higher functional density by using technologies such as micro-holes, fine lines, and multi-layer structures.

Advantages of Miniaturization design PCB:

• Miniaturization design
• Improve the circuit integration
• Better electrical performance
• Improve signal integrity
• Reduce costs

Product Features:

• High circuit density
• Fine line design
• Micro via and blind via technology
• Multi-level design
• Higher electrical performance
• Compact size

Manufacturing process:

• Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
• Blind and buried via design: Blind vias are holes that connect the outer and inner layers, while buried vias are holes that connect the layers. The use of these holes can help achieve a more compact layout and higher circuit density.
• High-precision etching: Due to the very small line spacing required by high-density PCBs, high-precision etching processes are needed to manufacture lines. The etching process needs to be very precise to ensure the stability and electrical performance of the fine lines.
• Interlayer connection: High-density PCBs usually use blind vias or buried vias for interlayer connection, and the integrity of signal transmission, antiference ability, and thermal management need to be considered during connection.
• Surface treatment: The surface of high-density PCBs is usually treated with special surface treatment processes such as gold plating, silver plating, OSP ( metal surface treatment), etc., to ensure good solderability and anti-oxidation.
• Precision assembly: The assembly process of high-density PCBs requires extremely high precision, and usually automated equipment is needed for precision welding and assembly to ensure that can be correctly soldered onto the circuit board.

Personalized customized services

Need material substitution or PTFE lamination?

We support Rogers, Taconic, F4B, and custom high-Dk materials.

Send us your Gerber files, stack-up requirements, and impedance specs – we’ll manufacture with precision.

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.

The company has two production bases in Dongguan andJiangxi, covering an area of 205000 square meters with a comprehensive monthly production capacity of 200000 square meters. The company's products are widely used in computer peripherals, communication, power supply, medical, automotive electronics, household appliances and other fields.

Our company advocate integrity, win-win and pioneering business philosophy, and put into practice the work style of "pragmatism, hard work and responsibility" to create a good corporate environment. Based on a new management model, advanced technology and equipment and good product quality, We always adhere to the corporate spirit of customer first and people-oriented.