High Density Interconnect PCB Green Oil Solder Mask Miniaturization Design

High-Density Interconnect PCB

HDI boards utilize advanced manufacturing techniques such as laser-drilled microvias, blind vias, and buried vias to connect different layers without occupying excessive surface area. This design allows for more components to be packed into a compact space, making it ideal for slim, lightweight products like smartphones, tablets, medical devices, and aerospace electronics.

Customized services(PCB or PCBA)

1. Gerber files (RS-274X),PCB thickness, ink color, surface treatment process.
2. BOM (if PCBA or SMT process is needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Manufacturing process:

• Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
• Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
• Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
• Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include gold plating,HSAL, OSP (Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
• High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance.

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Certificates and Honors

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.

As a professional supplier of customized boards, we work closely with our clients, leveraging our strengths in processes and technologies based on their design files to create high-performance, high-quality customized boards that support their product innovation and upgrades.Our company has two production bases in Dongguan andJiangxi, covering an area of 205000 square meters with a comprehensive monthly production capacity of 200000 square meters. The company's products are widely used in computer peripherals, communication, power supply, medical, automotive electronics, household appliances and other fields.

Our company advocate integrity, win-win and pioneering business philosophy, and put into practice the work style of "pragmatism, hard work and responsibility" to create a good corporate environment. Based on a new management model, advanced technology and equipment and good product quality, We always adhere to the corporate spirit of customer first and people-oriented.