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40um Accuracy Altium Flex Rigid PCB Board With Immersion Silver Or ENIG Surface

Categories Rigid Flex PCB
Brand Name: xingqiang
Model Number: Varies by goods condition
Certification: ROHS, CE
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 3000㎡
Delivery Time: 15-16 work days
Software: Altium
Warranty: 1 year
Position Accuracy: 40um
Samples: Available
Product Description: Flexible pcb 4 Layer
Surface Finish: HASL, ENIG, OSP
Pcb Type: Mobile Phone Rigid-Flex Multilayer PCB
Base Material: FR-4/High TG
Stiffener: TG 150°C FR4 Yellow
Silkscreen Min Size: 0.006"(0.15mm)
Flexibility: 1-8 Times
Thickness Range: 0.3mm
Drawing File Format: Gerber File
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40um Accuracy Altium Flex Rigid PCB Board With Immersion Silver Or ENIG Surface

Rigid-Flex PCB

The flex-rigid board combines the structural stability of rigid substrates with the bending flexibility of flexible materials, suiting 3D assembly in tight spaces. It boasts excellent insulation and temperature resistance, withstands repeated mechanical stress, and ensures stable circuitry. Widely used in smart devices, automotive electronics, etc., it aids lightweight and highly reliable device designs.


Advantages of Rigid-Flex PCB:

  • Optimize space and size
  • Reduce the use of connectors and cables
  • Adapt to complex spatial layout
  • High temperature resistance and chemical resistance


Product Features:

  • Combines rigid stability and flexible bending for tight spaces
  • stress; stable circuitry
  • Enables lightweight, high-reliability devices
  • Design flexibility


Manufacturing process:

  • Design and Material Selection: During the design phase, rigid and flexible segments are defined. Appropriate base materials (e.g., FR4, polyimide) and processes are selected to ensure seamless integration of rigid and flexible sections.
  • PCB Lamination: Rigid-flex PCB fabrication involves lamination of rigid and flexible components, typically via precision hot pressing and bonding to integrate multi-material circuit layers into a unified structure.
  • Etching and Hole Machining: The laminated substrate undergoes photolithography and etching to form target circuit patterns, with hole machining performed for component mounting and interlayer interconnection.
  • Surface Finishing: Surface treatment processes (e.g., gold plating, tin plating, OSP) are applied to protect circuit surfaces, ensuring superior solderability and oxidation resistance.
  • Assembly and Testing: Post-fabrication, the board undergoes component mounting or through-hole soldering, followed by electrical testing to verify proper circuit functionality and compliance with design specifications.
Quality 40um Accuracy Altium Flex Rigid PCB Board With Immersion Silver Or ENIG Surface for sale
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