5 Axis Linkage X-Ray Detection System for Fast Batch Semiconductor
Inspection
Microfocus X-Ray Inspection System X6000
Maintenance-free X-ray tube system supports efficient inspection of
BGA solder voids and PCB through-holes, combined with
high-precision imaging.
Key Advantages
- Next-generation 5-inch HD digital flat panel detector (FPD)
- 420×420mm worktable with up to 15KG load capacity
- Easy-to-use operation with only 2 hours of training needed
- Closed X-ray tube with 10,000+ hours service life and
maintenance-free operation
- Auto-navigation window - the table moves to the position you click
- Optional 360° rotary jig for multi-angle inspection
- 3-axis linkage system with adjustable movement speed
- Programmable inspection processes for automated batch inspection
Technical Specifications
X-ray Source
| Type | Closed, microfocus |
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| Max tube voltage | 90kV |
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| Max tube current | 200μA |
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| Focal spot size | 5μm |
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| Function | Auto preheat |
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Flat Panel Detector
| Effective area | 130mm×130mm |
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| Pixel size | 85μm |
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| Resolution | 1536×1536 |
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| Frame rate | 20fps |
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Work Table
| Size | 420mm×420mm |
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| Detectable area | 400mm×400mm |
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| Max load | 15kg |
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Equipment Parameters
| Magnification | Geometry 150X | System 1500X |
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| Inspection speed | Max 3.0s/point |
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| Dimensions | 1100mm (L) × 1000mm (W) × 1600mm (H) |
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| Weight | 1000kg |
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| Power supply | AC110-220V 50/60HZ |
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| Max power | 1300W |
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| Industrial PC | Intel I5 CPU, 8G RAM, 240GB SSD |
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| Displayer | 24" HDMI LCD |
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Safety Features
| Radiation leakage | No leakage (≤1μSv/h, international standard) |
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| Lead glass observation window | Transparent lead glass shields radiation while allowing internal
observation |
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| Window/door safety interlock | X-ray automatically powers off when window/door is opened |
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| Electromagnetic safety switch | Locks observation window when X-ray is active |
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| Emergency stop | Instant power-off button near operation position |
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| Tube protection | Software prevents X-ray tube from being left on |
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Software Capabilities
Basic Operation
Full keyboard and mouse control for all functions, including X-ray
tube activation and parameter adjustment.
Measurement Tools
Comprehensive measurement functions including distance, angle,
radius, perimeter, and distance rate calculations are ideal for
through-hole soldering analysis.
Automated Inspection
Three operation modes are available: manual point setup, array mode
for regular positions, and automatic feature recognition for
efficient batch inspection.
Image Processing
Adjustable brightness, contrast, and gain to achieve optimal image
quality. Save and retrieve inspection parameters for repeated
inspections.
Voids Rate Measurement
Automatically calculates solder ball void rate, area, and
circumference while identifying defects, and supports manual void
marking and parameter saving for consistent results.
Application Examples

X6000 inspection application example 1 - PCB inspection

X6000 inspection application example 2 - Component analysis
Working Principle

X6000 X-ray inspection machine working principle diagram