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High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF100-35-11UF
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 10000/day
Delivery Time: 3-5work days
Packaging Details: 1000pcs/bag
Products name: High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Keywords: Thermal Silicone Pad
Hardness: 75 Shore 00
Application: CPU GPU PC Motherboard
Color: Gray
Thermal conductivity& Compostion: 3.5W/m-K
Density: 3.0g/cc
Thickness: 0.02~0.20inch / 0.5~5.0mmT
Construction: Ceramic filled silicone elastomer
Continuos Use Temp: -40℃ to 200℃
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High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element


TIF100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:

> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating

> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED TV and lamps

Typical Properties of TIF®100-35-11UF Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer*******
Density3.0g/ccASTM D297
Thickness range0.02~0.20inch / 0.5~5.0mmTASTM C351
Hardness75 Shore 00ASTM 2240
Dielectric Breakdown Voltage>5500 VACASTM D412
Operating Temp-40 ~200℃*******
Dielectric Constant4.0 MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity3.5W/mKASTM D5470

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).


Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Quality High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element for sale
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