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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Categories Thermal Graphite Sheet
Brand Name: Ziitek
Model Number: TS-TIR300L
Certification: RoHs
Place of Origin: China
MOQ: 1000PCS
Price: 0.1-10 USD/PCS
Supply Ability: 100000pcs/day
Delivery Time: 2-3 work days
Packaging Details: 1000pcs/bag
Product name: Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings
Thickness: 0.15mm
Density: 1.4 g/cc
Thermal conductivity (Z Axis Direction): 2.5W/m-K
Hardness: 90 Shore A
Application: Between Heat Sinks And External casings
Color: Black
Keywords: Graphite Composite Thermal Pad
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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings


TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.


Feature

> Excellent thermal impedance
> Replaces traditional thermal grease

> High reliability
> Easy to apply to surfaces


Application

> Between transistors and heat sinks

> Between mechanical structures

> Between heat sinks and externalcasings


Typical Properties of TIR®300L series
Product NameTIR®300LTest Method
ColourBlackVisual
Reinforcement CarrierAluminum*****
Thickness range0.15 mmASTM D374
Hardness90 Shore 00ASTM D2240
Density1.4g/ccASTM D792
Volume Resistivity(ohm-cm)1*102ASTM D257
Continuous Use Temperature-60℃~ 180℃Ziitek Test Method
Thermal Conductivity(W/mK)2.5ASTM D5470
Thermal impedance(℃-in2/W)@30psi0.3ASTM D5470
Thermal impedance(℃-in2/W)@50psi0.25ASTM D5470
180° Peel Strength1.0N/25mmASTM D3330 (Steel,Immediate)

Packaging Details & Lead time


1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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