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| Categories | HDI PCB |
|---|---|
| MOQ: | 1 |
| Price: | Contact Us |
| Payment Terms: | T/T |
| Supply Ability: | 200,000+ m² PCB per Month |
| Layer: | 10 layers |
| Material: | Fr4 |
| Thickness: | 2.0 mm |
| Construction: | 2+N+2 |
| Min. Line Width/Space: | 0.1/0.1mm |
| Surface Treatment: | Immersion Gold |
| Type: | Customizable |
| Application: | Medical Device |
| Standard: | UL&IPC Standard &ISO |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
HDI PCB Board for Inverter with Green Solder Mask
♦ What is Solder Mask?
Solder Mask (also called solder resist or solder stop mask) is a thin, protective layer of polymer applied to the copper traces of a printed circuit board (PCB) to prevent oxidation, short circuits, and unintended solder connections during assembly.
♦ Types of Solder Mask?
| Type | Description | Common Uses |
|---|---|---|
| Liquid Photoimageable (LPI) | Applied as a liquid, exposed to UV light, and developed (most common). | Standard PCBs, high-precision designs. |
| Dry Film Solder Mask | Pre-formed film laminated onto the PCB, then UV-exposed and etched. | High-density PCBs (HDI). |
| Top & Bottom Side Masks | Applied only to specific sides (e.g., single-sided PCBs). | Simple boards with limited layers. |
| Peelable Solder Mask | Temporary mask that can be removed after soldering. | Selective protection during assembly. |
♦ Types of Solder Mask?
| Feature | Solder Mask Covered | Exposed Copper (No Mask) | Solder Mask Defined (SMD) Pads | Non-Solder Mask Defined (NSMD) Pads |
|---|---|---|---|---|
| Protection | Yes | No | Partial (mask covers edges) | No (pad extends beyond mask) |
| Solderability | Prevents solder spreading | Solder adheres fully | Controlled solder flow | More solder volume |
| Common Use | General traces | Test points, ground pads | Fine-pitch components (BGAs, QFNs) | High-reliability soldering |
♦ Technical Parameters
Item | Spec |
Layers | 1~64 |
Board Thickness | 0.1mm-10 mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size | 800mm×1200mm |
Min Hole Size | 0.075mm |
Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 17um--175um |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 17:01 |
Solder Mask Type | LPI |
SMT Min. Solder Mask Width | 0.075mm |
Min. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
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