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High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB

Categories High Frequency PCB
MOQ: 1
Price: Send us Gerber file for free quotation
Payment Terms: T/T
Layer: 12 Layer
Material: Rogers RT5880
Thickness: 1.8 mm
Min. Line Width/Space: 0.1/0.1mm
Copper Thickness: 1OZ
Surface Finishing: ENIG
Color: Blue
Application: Communication System
Certificate: UL & IPC Standard & ISO
Service: One Stop Turnkey Service
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High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB


Rogers RT5880 High Frequency PCB Satellite Communication System Application


What's High-Frequency PCB?


High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.



♦ Features of High-Frequency PCB

    • Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).

    • Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.

    • Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.

    • Strong heat dissipation: metal substrate + thermal simulation + phase change material, adapting to extreme environments from -55℃ to 125℃.

Difficulties in High-frequency PCB Manufacturing Process

    • Material processing is difficult: PTFE drilling is prone to burrs, and tungsten carbide drill bits + plasma cleaning are required.

    • High micropore precision: small holes are prone to offset, laser drilling + electroplating filling holes.

    • Difficult graphic transfer: small line width is prone to deviation, LDI lithography + fine etching.

    • Difficult inter-layer alignment: lamination is prone to misalignment, CCD alignment control offset ≤±50μm.

    • Difficult surface treatment: uneven coating affects performance, and the coating thickness is strictly controlled.


Technical Parameters


Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

PCB PrototypeFelx PCBRigid-Flex PCBAluminium PCB
Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

Quality High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB for sale
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