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| Categories | Through Hole Assembly | 
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| Certification: | ISO, UL, IPC, Reach | 
| Place of Origin: | China | 
| MOQ: | 1 | 
| Price: | Contact us | 
| Payment Terms: | T/T | 
| Delivery Time: | 5-30 days | 
| Layer: | 8 Layer | 
| Material: | FR4 | 
| Board Thickness: | 0.2-10mm | 
| Surface Finish: | ENIG/Immersion Gold | 
| Pin Space: | 0.25mm | 
| Application: | Smart Electronic | 
| Company Info. | 
| DQS Electronic Co., Limited | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
8 Layer Smart Electronic Through Hole PCB Assembly
♦ What Is Through-Hole Assembly Services?
Through-Hole Assembly Services involve the process of mounting electronic components onto a printed circuit board (PCB) by inserting their leads through drilled holes and soldering them to pads on the opposite side. This method is one of the oldest and most reliable PCB assembly techniques, often used for components requiring strong mechanical bonds or high-power applications.
♦ Key Features of BGA Assembly Services:
♦ Through-Hole vs. Surface-Mount (SMT) Assembly:
DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com
♦ Technical Parameters
| PCB Assembly Capability | |||||
| Item | Normal | Special | |||
| SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm | 
| Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
| Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
| Thickest | 4 mm | T>4.5mm | |||
| SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size | 200 * 125 | 200 * 125 | |||
| component thickness | T≤15mm | 6.5mm<T≤15mm | |||
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
| DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm | 
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
| Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
| Thickest | 3.5mm | T>2mm | |||
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2. Quality Guaranteed:
3. Premium Service:
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                                                            0.5oz-15oz OSP Wireless Charger PCBA Through Hole Soldering PCB Board Assembly
                                                    
                        
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                     Industrial Control FR4 Through Hole PCB Assembly ENIG Immersion Gold Surface
                                                                                        
                                                        
                        
                        
                        
                                                            Industrial Control FR4 Through Hole PCB Assembly ENIG Immersion Gold Surface
                                                    
                        
                     Electronic PCB Through Hole Assembly Service Low Volume Production ODM
                                                                                        
                                                        
                        
                        
                        
                                                            Electronic PCB Through Hole Assembly Service Low Volume Production ODM