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| Categories | Lighting PCB Assembly |
|---|---|
| MOQ: | 1 |
| Payment Terms: | T/T |
| Delivery Time: | 5-30 word days |
| Layer: | 4L |
| Material: | Al |
| Board Thickness: | 2.0mm |
| Min. Hole Size: | 0.20mm |
| Pin Space: | 0.20mm |
| Surface Finish: | SMT |
| Testing Method: | Flying Probe/AOI/FCT |
| Application: | Traffic lights |
| Service: | One-stop Service,PCB&PCBA,ODM and OEM |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
Efficient Heat Dissipation Lighting PCB Assembly Suitable for High-power Lamps
♦ What is Lighting PCB Assembly?
Lighting PCB Assembly is a specialized electronic assembly that integrates circuit boards with lighting components (e.g., LEDs, drivers) and control systems. It serves as the core functional unit in diverse lighting applications, combining electrical connectivity, thermal management, and intelligent control to enable efficient, durable, and feature-rich lighting solutions.
♦ Features of Lighting PCBA:
Intelligent Control: Equipped with smart sensing (e.g., auto on/off via human proximity detection) and remote functionality, including dimming, scheduling, and scene presets. Enables full-home smart control via mobile app or voice commands.
Dimming & Speed Regulation: Delivers precise light intensity and device speed adjustment for optimal comfort.
High Sensitivity: Advanced sensor PCBAs ensure rapid and accurate human motion detection.
Elegant Design: Aesthetically optimized to seamlessly integrate with diverse interior environments.
♦ Applications of Lighting PCBA:
♦ Technical Parameters
PCB Assembly Capability | |||||
Item | Normal | Special | |||
SMT Assembly | PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly | PCB specification | Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm | |||
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